Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for manufacturing heat dissipation via hole of printed circuit board and printed circuit board

A printed circuit board, heat dissipation via technology, applied in the direction of printed circuit manufacturing, printed circuits, printed circuit components, etc., to achieve the effect of solving miniaturization and intensive soldering heat dissipation, increasing the specific surface area of ​​heat dissipation, and reducing the temperature

Active Publication Date: 2018-05-29
SHENNAN CIRCUITS
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Embodiments of the present invention provide a method for manufacturing heat dissipation vias of a printed circuit board and a printed circuit board, which can solve the problems of miniaturization and intensive soldering of PCB products and heat dissipation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for manufacturing heat dissipation via hole of printed circuit board and printed circuit board
  • Method for manufacturing heat dissipation via hole of printed circuit board and printed circuit board
  • Method for manufacturing heat dissipation via hole of printed circuit board and printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0046] In order to enable those skilled in the art to better understand the solutions of the present invention, the following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative efforts belong to the protection scope of the present invention.

[0047] The terms "first", "second", "third" and "fourth" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily to describe a specific order or sequentially. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the e...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The embodiment of the present invention discloses a method for manufacturing heat dissipation via holes of a printed circuit board, which includes: after obtaining the laminated printed circuit board, determining the heat dissipation area of ​​the electronic components on the printed circuit board; A first heat dissipation via hole is opened on the upper surface of the area; a metal layer is plated on the inner surface of the first heat dissipation via hole; resin is filled in the first heat dissipation via hole; the first heat dissipation via hole filled with resin A second heat dissipation via is opened at the port; a metal layer is plated on the inner surface of the second heat dissipation via; resin is filled in the second heat dissipation via, and a plurality of small heat dissipation vias are distributed in the large heat dissipation via The structure increases the heat dissipation specific surface area of ​​the heat dissipation vias, transfers the heat generated by electronic components, reduces the temperature of the printed circuit board, and solves the problem of miniaturization and intensive soldering of PCB products.

Description

technical field [0001] The invention relates to the field of PCB (Printed circuit board) printed circuit board manufacturing, in particular to a method for manufacturing heat dissipation via holes of a printed circuit board and a printed circuit board. Background technique [0002] As the design of electronic products becomes more and more complex, the copper foil becomes thicker and the required lines are denser, more high-power devices are used in the multi-layer PCB board manufacturing process, the wiring of the PCB board is more intensive, and the carrying current is getting higher and higher. The larger the size, these high-power devices will generate a lot of heat during operation, the power consumption per unit area will be larger, and most of the heat generated by the components will be transmitted to the PCB board, and the space of the multi-layer PCB board is small, so that the PCB board The temperature rises rapidly. If the heat is not dissipated in time, due to t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/02H05K3/00
Inventor 丁大舟刘宝林郭长峰缪桦
Owner SHENNAN CIRCUITS
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com