Laminated sealing sheet

Abstract

A glass sealing sheet comprising a glass core layer having a first side and a second side, a first cladding layer bonded to the first side of the glass core layer, and / or a second cladding layer bonded to the second side of the glass core layer. The first cladding layer is comprises a glass composition that is absorbing of radiation over at least a portion of an emission wavelength range.

Description

[0001] This application claims priority under 35 U.S.C. §119 to U.S. Provisional Application Serial No. 61 / 835,120, filed June 14, 2013, the contents of which this application is based upon, which is hereby incorporated by reference in its entirety. [0002] background [0003] field [0004] The present invention relates generally to laminated sealing sheets and in particular to laminated sealing sheets for glass-to-glass sealing to form hermetically sealed glass packages. technical background [0005] Hermetic glass-to-glass seals are used in many industries, such as display technology, semiconductor technology, lighting technology and photovoltaic technology. Some previously used hermetic glass-to-glass sealing processes utilize elevated temperatures during the sealing process, which can lead to damage to the resulting sealed product. For example, when sealing an organic light emitting device / diode (OLED), the sealing process that transfers excess heat to the active organ...

AI Technical Summary

Problems solved by technology

Therefore, the thin film material is sputter coated onto the glass carrier rather than being melt-formable, which increases the cost of sputter coating the material onto the glass, especially since sputtering itself is a slow process and may require large vacuum unit

Additionally, the film seal may be damaged, e.g. scratched or peeled off

Glass-to-glass sealing can also be accomplished using polymeric or filled polymeric materials, however these seals may not provide the airtightness required for a particular application

Glass sealing can also be achieved by anodic bonding, but this would require high voltages, which is not suitable for applications where there are already patterned circuits on the glass

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