Unlock instant, AI-driven research and patent intelligence for your innovation.

Laser direct writing system realizing vertical double-side exposure and based on DMD (digital micromirror device) projection light paths

A laser direct writing, double-sided exposure technology, applied in microlithography exposure equipment, photolithography process exposure devices, optics, etc., can solve the problems of difficult to increase production capacity, difficult to operate time, etc., to achieve efficiency improvement, increase Efficiency and productivity improvement

Inactive Publication Date: 2016-04-13
JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
View PDF5 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

The invention relates to an improved method for producing high volume electronic devices by directly projecting light onto their surfaces instead of relying on traditional methods like lithography or etchings that require multiple steps. This technology allows companies to increase productivity while reducing costs associated therewith without sacrificing accuracy.

Problems solved by technology

The technical problem addressed by this patented method is how to improve the efficiency at which different types of photolithographic processes take place during manufacturing without requiring multiple stages or prolonged periods between operations.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Laser direct writing system realizing vertical double-side exposure and based on DMD (digital micromirror device) projection light paths

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0009] The present invention will be further described below in conjunction with the accompanying drawings.

[0010] Such as figure 1 As shown, the DMD projection optical path laser direct writing vertical double-sided exposure system includes a stepping axis 2 and a scanning axis 4 arranged on a base 3 ; and a DMD device projection optical path 5 fixed on both sides of the base 3 .

[0011] Further, the stepping axis 2 and the scanning axis 4 are connected to the linear motor and the orientation guide rail. The directional and precise movement of the stepping axis 2 and the scanning axis 4 is realized through the drive of the linear motor and the directional guide rail together with the precision control element.

[0012] The projection optical path 5 of the DMD device is composed of a group of tiny plane mirror arrays. The laser light source hits the laser light on the DMD through the illumination light path and reflects it to the side. When the projection optical path 5 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a laser direct writing system realizing vertical double-side exposure and based on DMD (digital micromirror device) projection light paths and belongs to the technical field of rapid scanning exposure of a direct writing type lithography machine. The system comprises a stepping shaft (2), a scanning shaft (4) and DMD projection light paths (5), wherein the stepping shaft (2) and the scanning shaft (4) are arranged on a base (3); the DMD projection light paths (5) are fixed on two sides of the base (3). According to the laser direct writing system realizing the vertical double-side exposure and based on the DMD projection light paths, front and reverse sides of an exposed workpiece can be exposed simultaneously, the working efficiency is doubled, the productivity is remarkably improved, and the working efficiency is improved.

Description

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Owner JIANGSU YSPHOTECH INTERGRATED CIRCUIT EQUIP CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More