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Power element module and its heat sink

A technology for power components and radiators, applied in the field of power component modules and their radiators, can solve the problem of uneven pressure distribution of power component modules, and achieve the effects of simple structure, guaranteed stability, and not easy to deform.

Active Publication Date: 2018-01-23
XUJI GRP +2
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a power element module to solve the problem of uneven pressure distribution of the power element module in the prior art; at the same time, the present invention also provides a heat sink for the above power element module

Method used

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  • Power element module and its heat sink
  • Power element module and its heat sink
  • Power element module and its heat sink

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Embodiment Construction

[0023] An embodiment of the power element module in the present invention Figure 1~Figure 4 As shown, it includes a crimping mechanism and a radiator 40 and a thyristor 50 clamped in the crimping mechanism. The crimping mechanism includes a middle frame body 10 and pressure distribution adjustment units respectively arranged at the left and right ends of the middle frame body 10, and the pressure distribution adjustment units are respectively a top pressure device and an elastic clamping device.

[0024] The middle frame body 10 includes a left end plate 11, a right end plate 12, and an insulating tie rod arranged between the two. The left end plate 11 and the right end plate 12 are both metal end plates. The insulating tie rods are divided into an upper insulating tie rod 13 and a lower insulating tie rod 14. , Wherein the distance between the lower insulating tie rods 14 is smaller than the distance between the upper insulating tie rods 13 and is not greater than the front-rea...

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PUM

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Abstract

The invention relates to a power element module and a radiator thereof. The heat sink of the power element module includes a heat sink body and support blocks arranged on the front and rear sides of the upper part of the heat sink body. The bottom surface of the support block is provided with an upper guide groove for guiding and moving the upper insulating rod along the left and right direction. The lower end surface of the radiator is provided with a lower guide groove cooperating with the lower insulating pull rod to guide and move along the left and right directions. Through the upper guide groove and the lower guide groove, the radiator can form a good guide fit with the insulating pull rod, and the support is stable, and because the upper guide groove is set on the support block and the lower guide groove is set on the lower end surface of the radiator, It is not easily deformed, and compared with the prior art, it can well ensure the uniformity of the pressure of the power element module and better ensure the stability of the crimped element. At the same time, the intermediate frame of the present invention does not need to be provided with an insulating support plate, the structure is simple, and the assembly of the intermediate frame and the assembly and maintenance of the power element and the radiator are convenient.

Description

Technical field [0001] The invention relates to a power element module and its heat sink. Background technique [0002] With the development of semiconductor technology, power components are widely used in high-power power electronic rectification and inverter devices, such as high-voltage DC transmission, flexible DC transmission, DC ice melting equipment, SVC, high-power DC circuit breakers and other occasions. Power components generally include IGBT, IGCT, GTO, thyristor, diode, etc. [0003] At present, the crimping of power components is generally realized through a crimping mechanism, for example, a thyristor valve section and its pressing device disclosed in a Chinese invention patent application with application number 201310259052.6 and application publication number CN 103354233 A, wherein the pressing device is The crimping mechanism includes a frame. The frame includes a middle frame and left and right end plates arranged at the left and right ends of the middle frame....

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L23/40
Inventor 肖晋朱新华王艳张凯焦洋洋于丽阳孙晶晶窦琼珠
Owner XUJI GRP