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Method for manufacturing sealing structure of implantable device

A technology of sealing structure and manufacturing method, which is applied in the field of manufacturing of sealing structure, can solve problems such as aging, degradation, cracking, re-crosslinking, adverse biological reactions, negative effects of implanted objects, etc., to improve biological safety and long-term implantation Into the effect of reliability

Active Publication Date: 2016-08-24
SHENZHEN SIBIONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Since implantable devices need to be implanted in the body and remain in the body for a long time, the implantable devices implanted in the body need to face the complex physiological environment in the body, which is often harsh. It is possible to interact with the tissues and organs around the implant site. For example, the materials of implantable devices will undergo physical or chemical reactions such as aging, degradation, cracking, and re-crosslinking, thereby causing negative effects on the implanted object, such as causing inflammation, etc. adverse biological reaction

Method used

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  • Method for manufacturing sealing structure of implantable device
  • Method for manufacturing sealing structure of implantable device
  • Method for manufacturing sealing structure of implantable device

Examples

Experimental program
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Effect test

no. 1 approach

[0037] figure 1 It is a perspective structural view showing the sealing structure 10 of the implantable device according to the first embodiment of the present invention. figure 2 is shown figure 1 The internal schematic diagram of the sealing structure 10 of the implantable device is shown.

[0038] like figure 1 and figure 2 As shown, the sealing structure 10 of the implantable device involved in this embodiment includes a ceramic base 11 , a metal ring 12 and a metal cover 13 . Specifically, the sealing structure 10 is formed as a sealing body having an accommodating space for accommodating the electronic component 30 by disposing (for example, welding) a metal ring 12 and a metal cover 13 on the ceramic substrate 11 . In addition, the bottom of the sealing structure 10 (ceramic substrate 11 in this embodiment) is provided with a feed-through electrode or a feed-through electrode array for electrical connection with the outside (for example, for electrical stimulation...

no. 2 approach

[0103] Below, refer to Figure 8 , the sealing structure 101 of the implantable device according to the second embodiment of the present invention will be described. In the following description, for ease of understanding, Figure 8 to Figure 11 All of the sealing structures only show the ceramic base part, omitting the description of the metal ring and the metal cover part.

[0104] Figure 8 A schematic structural diagram of the ceramic substrate 111 of the sealing structure 101 of the implantable device is shown. For convenience of description, the sealing structure 101 here only shows the parts different from the sealing structure 10 of the implantable device related to the first embodiment. like Figure 8 As shown, the ceramic substrate 111 of the sealing structure 101 of the implantable device according to the second embodiment of the present invention is different from the ceramic substrate 11 of the sealing structure 10 of the implantable device according to the fi...

no. 3 approach

[0111] Below, refer to Figure 9 , the sealing structure 102 of the implantable device according to the third embodiment of the present invention will be described.

[0112] Figure 9 It is a schematic cross-sectional view showing the ceramic substrate 112 of the sealing structure 102 of the implantable device according to the third embodiment of the present invention. For convenience of description, the sealing structure 102 here only shows the parts different from the sealing structure 10 of the implantable device related to the first embodiment. like Figure 9 As shown, the ceramic substrate 112 of the sealing structure 102 of the implantable device according to the third embodiment of the present invention is different from the ceramic substrate 11 of the sealing structure 10 of the implantable device according to the first embodiment of the present invention The point is that the metal post 202 in the ceramic substrate 112 is composed of a post body 202a and two post p...

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Abstract

The invention provides a manufacturing method of a seal structure of an implantation device, which comprises the following steps: preparing a mold which is provided with a plurality of through holes and used for manufacturing a ceramic billet sheet; penetrating a plurality of metal columns through the through holes, and keeping one end of each metal column; preparing ceramic powder, and filling the ceramic powder into the mold; carrying out pressure molding on the ceramic powder by using the mold to form a ceramic billet sheet, and penetrating the metal columns through the upper surface and lower surface of the ceramic billet sheet; and sintering the metal columns and ceramic billet sheet together to form a metal-column-bearing ceramic substrate, wherein in the sintering process, a pressure is applied onto the ceramic billet sheet along the long side direction of the metal columns. Compared with the existing sintering technique, the metal columns can be combined with the ceramic structure more closely, thereby enhancing the biosafety and long-term implantation reliability of the seal structure.

Description

technical field [0001] The invention relates to a manufacturing method of a sealing structure of an implanted device. Background technique [0002] At present, implantable devices have been widely used in various aspects such as restoring body functions, improving the quality of life or saving lives. Such implantable devices include, for example, implantable cardiac pacemakers, deep brain stimulators, cochlear implants, artificial retinas, and the like. [0003] Since implantable devices need to be implanted in the body and remain in the body for a long time, the implantable devices implanted in the body need to face the complex physiological environment in the body, which is often harsh. It is possible to interact with the tissues and organs around the implant site. For example, the materials of implantable devices will undergo physical or chemical reactions such as aging, degradation, cracking, and re-crosslinking, thereby causing negative effects on the implanted object,...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C04B35/645C04B35/10
CPCC04B35/10C04B35/645C04B2235/96
Inventor 韩明松赵瑜
Owner SHENZHEN SIBIONICS CO LTD