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Method of Opening Holes in Convex Ladder Thickened Steel Sheets and Heightening Reflow Soldering Spots

A reflow soldering and ladder technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problems of poor accuracy and consistency, high defect rate and rework rate, and the inability to achieve 0.5mm height solder joints, etc., to improve The effect of qualified rate, reducing heat treatment process and shortening production cycle

Active Publication Date: 2018-06-19
ZHUHAI XINRUNDA ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In the SMT reflow soldering of PCB electronic components in the prior art, the bottom net is a stencil with a thickness of 0.13mm or 0.15mm, and the maximum thickness of the solder paste after opening and demoulding can only reach 0.18mm and 0.20mm, and the wave soldering and dip soldering process It is generally impossible to achieve solder joints with a height of 0.5mm. The solder joint height requirement of some PADs of existing electronic assemblies sometimes reaches 0.5mm to 0.7mm. Manual tinning, but the accuracy and consistency of manual tinning are poor, and the defect rate and rework rate are high.

Method used

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  • Method of Opening Holes in Convex Ladder Thickened Steel Sheets and Heightening Reflow Soldering Spots
  • Method of Opening Holes in Convex Ladder Thickened Steel Sheets and Heightening Reflow Soldering Spots
  • Method of Opening Holes in Convex Ladder Thickened Steel Sheets and Heightening Reflow Soldering Spots

Examples

Experimental program
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Effect test

Embodiment 1

[0056] 0603PAD, the target PAD height is 0.30mm, the thickness of the bottom steel mesh is 0.13mm, and the thickness of the convex stepped steel sheet is 0.15mm.

[0057] 1) Calculate the enlarged side area S=2.01mm 2

[0058] 2) L:W=L':W'=0.83:0.8=1.03

[0059] 3) Take W: 1.40mm, then L=1.43mm

[0060] If the equal width method is used to enlarge, then the first enlarged length L1=the second enlarged length L2.

Embodiment 2

[0062] 0805PAD, the target PAD height is 0.50mm, the thickness of the bottom steel mesh is 0.13mm, and the thickness of the convex stepped sheet is 0.15mm.

[0063] 1) Calculate the enlarged side area S to be 8.48mm 2

[0064] 2) L:W=L':W'=1.4:1.2=1.17

[0065] 3) Take W=2.69mm, then L=3.16mm

[0066] Because there are other devices on one side of the 0805PAD, if there is not enough tin printing area, the one-side enlargement method is adopted, and the first enlargement length L1>the second enlargement length L2.

[0067] As can be seen from the above, the method for increasing the height of the reflow solder joints by opening holes in the convex stepped thickened steel sheets of the present invention, and the method for increasing the height of the reflow solder joints by opening holes in the thickened steel sheets of the convex steps, through the thickened steel sheets of the convex steps, Changing manual tinning to machine tinning improves production efficiency and produ...

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Abstract

The invention relates to a convex step thickening steel sheet trepanning, heightening and reflow soldering-based solder joint formation method. The method includes the following steps that: the height of a convex step thickening steel sheet is selected according to the thickness of a steel mesh; the area of the convex step thickening steel sheet is calculated according to a lateral magnification formula; the length L and width W of the convex step thickening steel sheet are calculated according to the length L and width W of a target PAD; a magnification mode is selected according to the conditions of devices around the target PAD; laser cutting is performed on the magnified convex step thickening steel sheet, so that a step trepanned steel sheet can be obtained; the step trepanned steel sheet is bonded on the bottom mesh through an adhesive; and after reflow soldering is performed, a target solder joint with required height can be obtained. According to the convex step thickening steel sheet trepanning, heightening and reflow soldering-based solder joint formation method of the invention, the convex step thickening steel sheet is adopted, manual tin adding is replaced by machine tin printing; and therefore, production efficiency can be greatly improved, and the qualified rate of products can be greatly improved.

Description

technical field [0001] The invention belongs to the field of electronic assembly SMT surface mounting technology, in particular perforated reflow soldering. Background technique [0002] In the SMT reflow soldering of PCB electronic components in the prior art, the bottom net is a stencil with a thickness of 0.13mm or 0.15mm, and the maximum thickness of the solder paste after opening and demoulding can only reach 0.18mm and 0.20mm, and the wave soldering and dip soldering process It is generally impossible to achieve solder joints with a height of 0.5mm. The solder joint height requirement of some PADs of existing electronic assemblies sometimes reaches 0.5mm to 0.7mm. Manual tinning, but the accuracy and consistency of manual tinning are poor, and the defect rate and rework rate are high. . Contents of the invention [0003] Based on this, aiming at the prior art, the technical problem to be solved by the present invention is to provide a kind of reflow soldering with c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/34
CPCH05K3/3494H05K2203/0415H05K2203/043H05K2203/0455
Inventor 张渊华刘平伟
Owner ZHUHAI XINRUNDA ELECTRONICS CO LTD
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