Processing method of specially-shaped thick and thin Clip parts

A processing method and special-shaped technology, which is applied in the field of parts stamping processing, can solve problems such as affecting functions, failing to meet theoretical value requirements, and welding deviation, so as to reduce production costs, stabilize dimensions and various process parameters, and improve yield rates. Effect

Active Publication Date: 2016-04-27
SUZHOU UIGREEN MICRO & NANO TECH CO LTD
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Problems solved by technology

[0003] However, in the actual use process, there are some disadvantages in this processing method.
On the one hand, the external positioning accuracy of this process is not high, and the position of the copper sheet to be welded will change during the movement process before welding, resulting in welding deviation and a high defect rate; on the other hand, becau

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  • Processing method of specially-shaped thick and thin Clip parts

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Embodiment Construction

[0025] The invention discloses a method for processing special-shaped thick and thin Clip parts suitable for processing and manufacturing special-shaped thick and thin Clip parts.

[0026] A method for processing special-shaped thick and thin Clip parts, comprising the steps of:

[0027] S1. Plate preparation steps: According to the processing needs, use the integrated calendering process to make corresponding special-shaped plates, such as figure 1 As shown, the special-shaped plate includes an integrally connected base part and a raised part, the base part is the substrate 1, and the raised part is arranged on the upper surface of the said substrate 1, including being arranged on the said substrate 1 Two sections of edge protrusions 2 on both sides, and two sections of central protrusions 3 arranged in the middle of the substrate 1;

[0028] S2. One-time stamping step: positioning the special-shaped plate, and after the positioning is completed, send the special-shaped plat...

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Abstract

The invention relates to a processing method of specially-shaped thick and thin Clip parts. The processing method of the special-thickness Clip part comprises the following steps: S1, preparing plates; S2, punching for a first time; S3, carrying out precise CNC; and S4, punching for a second time. The invention adopts a novel processing and manufacturing process, wherein the novel processing and manufacturing process comprises the steps of punching specially-shaped plates, subsequently carrying out precise CNC milling machine processing for a first time, then punching for a second time. The specially-shaped calendaring technique is used in the punching process, so that a bulge part of a Clip part and a substrate part form an integrated structure; the problem of incomplete lamination is avoided, so that the influence on the design function of the product can be avoided. In addition, all the processing techniques in the processing method of specially-shaped thick and thin Clip parts are controllable processes which are widely used in the prior art, so that the size of the product and the stability of various process parameters can be effectively ensured; the manufactured product can meet various design requirements; meanwhile, the yield of the processed product can also be greatly improved; the production cost of the processing enterprise can be reduced.

Description

technical field [0001] The invention relates to a processing method for special-shaped thick and thin Clip parts, which is especially suitable for processing and manufacturing special-shaped thick and thin Clip parts, and belongs to the field of stamping processing of parts. Background technique [0002] In the traditional processing process, all kinds of special-shaped thick and thin Clip products are manufactured by welding process. The production process is mainly to position the two products through the external mechanism, and then rely on the ultrasonic welding process to fix them together. The working principle of the ultrasonic welding process can generally be understood as making the molecules vibrate at high frequency in a short period of time to penetrate each other, thereby completing the bonding. [0003] However, in actual use, this processing method has some disadvantages. On the one hand, the external positioning accuracy of this process is not high, and the...

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Application Information

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IPC IPC(8): B23P15/00
CPCB23P15/00
Inventor 骆兴顺钱晓晨
Owner SUZHOU UIGREEN MICRO & NANO TECH CO LTD
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