Manufacturing method of waterproof and moisture-proof temperature sensor and temperature sensor made therefrom

Abstract

A manufacturing method for a waterproof and moisture-proof temperature sensor comprises the following steps: (1) wire cutting: preparing TPU wires (40) of a same length by means of cutting according to a set wire length; (2) chip welding: welding a chip (10) having a function of temperature measurement at one end of each TPU wire; (3) epoxy resin encapsulation: encapsulating each chip and the corresponding exposed wire by using a prepared epoxy resin encapsulation material, and carrying out heat curing; and (4) TPU encapsulation: preparing a liquid TPU encapsulation material, encapsulating an epoxy resin layer (20) formed in Step (3) by using a layer of the liquid TPU encapsulation material, and carrying out curing to form a TPU inner encapsulation layer (30); then encapsulating the TPU inner encapsulation layer by using another layer of the liquid TPU encapsulation material, and carrying out curing to form a TPU outer encapsulation layer (50). In the manufacturing method for the waterproof and moisture-proof temperature sensor, by means of TPU encapsulation, the prepared temperature sensor is cold-resistant, heat-resistant, waterproof, moisture-proof, wear-proof, oil-proof and aging-resistant, and has higher shearing strength and impact toughness, and reliable and stable electrical properties.

Description

technical field [0001] The invention relates to a manufacturing method of electronic components, in particular to a manufacturing method of a waterproof and moisture-proof temperature sensor and the manufactured temperature sensor. Background technique [0002] Using the temperature measuring element as the core component, temperature sensors composed of different packages are widely used in various temperature detection and temperature control circuits, which play a central role in converting temperature variables into required electronic signals in the circuit. [0003] see figure 1 , which is a structural schematic diagram of a temperature sensor in the prior art. Existing temperature sensors are made by following the steps below: [0004] (1) Welding the chip 1 with temperature measurement function on the electronic wire 4; [0005] (2) Encapsulate the chip 1 welded on the electronic wire 4 with the prepared epoxy resin once and heat and cure, epoxy resin encapsulatio...

AI Technical Summary

Problems solved by technology

[0007] 1) The adhesion between the epoxy resin and the electronic wire 4 is not good. When the product is subjected to cold and heat shocks for a long time, gaps will be formed between the epoxy resin and the electronic wire 4, resulting in water immersion, making the electrical performance of the product unstable or even damaged;

[0008] 2) The tear resistance is not good, and the bending strength is poor;

[0009] 3) The insulating layer of the electronic wire 4 has poor compactness;

[0010] 4) The compactness of epoxy resin is also poor

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