A crimping type igbt module

Abstract

The invention provides a novel crimping type IGBT module. The novel crimping type IGBT module comprises a tube shell, and platy metal electrodes coaxially arranged at the upper and lower ends of the tube shell, wherein lug bosses are fixed on the inner side face of the metal electrode at the lower end; power sub modules are crimped between the lug bosses and the metal electrode at the upper end; the lug bosses are arranged by taking the center of the metal electrode at the lower end as the center of a circle; and the lug bosses are distributed on the inner side face of the metal electrode at the lower end circumferentially from the inner layer to the outer layer at an equidistributed manner in sequence. According to the technical scheme of the novel crimping type IGBT module provided by the invention, the problem of overhigh overshoot of partial current when transient state current passes through the lug bosses of the crimping type IGBT module is solved; and the reliability of the crimping type IGBT module is improved, and the safety operation area of the crimping type IGBT module is enlarged.

Description

technical field [0001] The invention relates to a crimping type IGBT module, in particular to a crimping type IGBT module capable of reducing the IGBT switching transient current overshoot. Background technique [0002] In 1993, Fuji Corporation first proposed the concept of μ-stack, which combined the common advantages of GTO and IGBT. It was extensively researched in the late 1990s, and the commercialization of press-fit IGBT was carried out around 2005. Produce. The two mainstream products currently on the market are ABB's StakPak and Westcode's Press Pack IGBT. In addition, Toshiba's IEGT device is similar to this. The press-connect IGBT has the advantages of high switching frequency, failure short circuit, double-sided heat dissipation, and easier series connection. It is very suitable for applications such as electric locomotives and VSC-HVDC. Compared with the traditional soldered IGBT module, the press-fit IGBT module has a smaller stray inductance of the chip circ...

AI Technical Summary

Problems solved by technology

[0004] For the Westcode device structure, the existing research results show that with the increase of the number of bosses, due to the inconsistency of the stray inductance, the current between the bosses has a problem of uneven flow during the turn-on and turn-off process. And some chips have a large current overshoot during the turn-on process, which reduces the overall safe working area of ​​the device.

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