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Sintering mold

A technology for molds and mold bodies, applied in the field of sintering molds, can solve problems such as low productivity and inability to handle multiple batches of samples

Active Publication Date: 2016-05-11
INST OF PHYSICS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, the existing sintering system cannot realize the synthesis and sintering of a large batch of samples at one time, and the yield is relatively low, which cannot meet the needs of processing multiple batches of samples at one time.

Method used

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Embodiment Construction

[0024] Various embodiments of the invention will be described in more detail below with reference to the accompanying drawings. In the various drawings, the same elements are denoted by the same or similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale.

[0025] The sintering mold provided by the invention is suitable for sintering systems such as pulse discharge plasma sintering, direct current sintering or hot pressing sintering. Below in conjunction with specific embodiment the sintering mold of the present invention is introduced in detail:

[0026] Such as image 3 , 4 As shown, the sintering mold provided by the present invention includes an indenter 101 , a mold body 102 , a pressure-bearing platform 103 and a gasket 104 . The mold main body 102 is a cylindrical structure with a certain thickness, and a plurality of cavities 121 are arranged along its axial direction, and the cavities 121 are through holes com...

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Abstract

The invention relates to a sintering mold which comprises pressing heads, a mold body, a pressure bearing platform and gaskets. The mold body is provided with a plurality of cavities, the number and positions of the pressing heads correspond to those of the cavities, and the pressing heads are fixed to the first surface of a pressing plate. The mold body is placed on the pressure bearing platform, and the gaskets are placed on the pressure bearing platform and located in the cavities. According to the sintering mold provided by the invention, the mold is provided with the multiple cavities so that a large batch of samples can be synthesized and sintered with one-time hot pressing; meanwhile, since the sizes of the cavities are different, the temperatures in the cavities can be regulated and controlled, the temperatures in the cavities are different from one another, and the large batch of samples obtained at a time are completely different. In addition, the micro sample synthesized in each cavity can reach the microgram level, the diameters of the cavities are between 2 mm and 12.7 mm, and the sizes of synthetic materials are adequate for testing of various surface features and physical properties.

Description

technical field [0001] The invention relates to the field of spark plasma sintering equipment, in particular to a sintering mold. Background technique [0002] Spark plasma sintering (SparkPlasmaSinteringSPS) is a new technology for preparing functional materials. It has the characteristics of fast heating, short sintering time, controllable structure, energy saving and environmental protection, etc. It can be used to prepare metal materials, ceramic materials, composite materials, and can also be used to Preparation of nano-bulk materials, gradient materials, etc. [0003] High-throughput synthesis is the most cutting-edge topic in the development of materials science today, and its core is to develop high-throughput and high-efficiency material synthesis methods, process technologies and advanced equipment. Solid materials are the most important members of the material science family, including metals and alloys, inorganic non-metallic materials, and organic polymer mater...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105C04B35/64
CPCB22F3/105C04B35/64
Inventor 赵怀周陈小龙谷林李善明曹丙磊
Owner INST OF PHYSICS - CHINESE ACAD OF SCI
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