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Roller parts and substrate processing equipment

A technology of roller parts and substrates, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, and cleaning methods using liquids. It can solve the problems of cleaning liquid retention and supply of cleaning parts, etc., and achieve the effect of improving processing capacity and easy discharge

Active Publication Date: 2021-08-27
EBARA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In addition, there is a problem that a slit is formed on the bottom surface of the pen cleaning member described in Patent Document 2 in which the slit is formed on the bottom surface, but when the cleaning liquid is supplied from the outside of the pen cleaning member to the surface of the substrate, the cleaning of the slit enters. Fluid stagnates in the seam and fresh cleaning fluid cannot be supplied to the cleaning part

Method used

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  • Roller parts and substrate processing equipment
  • Roller parts and substrate processing equipment
  • Roller parts and substrate processing equipment

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0118] 1. First Embodiment: Substrate Cleaning Apparatus with Roller Cleaning Unit

[0119] figure 1It is a perspective view showing the outline of the substrate processing apparatus (substrate cleaning apparatus) according to the first embodiment. Such as figure 1 As shown, the substrate cleaning device 10 has: a plurality of (in figure 1 4) spindles 11 (substrate holding unit), the plurality of spindles 11 serve as a substrate rotation mechanism, support the peripheral portion of the substrate S so that the surface of the substrate S faces upward, and rotate the substrate S horizontally; the upper roller cleaning unit ( The roller sponge) 12 is rotatably supported by an unillustrated roller holder, and the lower roller cleaning member (roller sponge) 13 is rotatably supported by an unillustrated roller holder. The upper roller cleaning member 12 and the lower roller cleaning member 13 are cylindrical and elongated, and are made of, for example, PVA. In addition, the u...

no. 2 Embodiment approach

[0158] 2. Second Embodiment: Substrate Cleaning Apparatus with Pen Cleaning Unit

[0159] Figure 15 It is a perspective view showing the outline of a substrate processing apparatus (substrate cleaning apparatus) according to the second embodiment. Such as Figure 15 As shown, the substrate cleaning device 20 has: a plurality of (in Figure 15 There are 4) main shafts 21 (substrate holding units), and the plurality of main shafts 21 support the peripheral portion of the substrate S so that the surface of the substrate S faces upward and rotate the substrate S horizontally as a substrate rotation mechanism; The pillar 26 that extends in the horizontal direction; The swing arm 27 that extends in the horizontal direction, one end is mounted on the top end of the pillar 26 in a rotatable manner; on the lower surface of the other end of the swing arm 27. In addition, two cleaning liquid supply nozzles 24 and 25 for supplying cleaning liquid to the surface of the substrate W are...

no. 3 Embodiment approach

[0181] 3. Third Embodiment: Substrate Cleaning Apparatus with Pen Polisher

[0182]In the above-mentioned first and second embodiments, an example in which the present invention is applied to a substrate cleaning apparatus has been described, but the present invention can also be applied to a buffing apparatus for buffing a polished substrate. That is, the present invention can be applied not only to a substrate cleaning device using a soft sponge material such as PVA but also to a buffing device. Here, the buffing includes at least one of buffing and buffing. The buffing device may be integrated with the polishing device, or may be a separate device from the polishing device.

[0183] The buffing treatment refers to a process of polishing and removing the treated surface of the substrate by moving the substrate and the polishing pad relative to each other while bringing the polishing pad into contact with the substrate, and sandwiching slurry (polishing liquid) between the s...

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PUM

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Abstract

The present invention provides a roller member, a pen member, and a substrate processing device. In the roller cleaning member having the bumps formed on the surface, the cleaning power of each bump is improved. The roller cleaning member (50) for scrubbing the surface to be cleaned of the substrate S has a plurality of protrusions (54) on the surface. Each protrusion (54) has a slit (542) extending non-parallel to the rotation direction c of the roller cleaning member (50), and a plurality of The upstream edge (541e1, 541e2) is the most extreme when the cleaning surface (541) of the protrusion (54) comes into contact with the surface to be cleaned of the substrate S due to the rotation of the roller cleaning member (50). The edge that comes into contact with the surface being cleaned first.

Description

technical field [0001] The present invention relates to a roller member (particularly a roller member having bumps on the surface) that treats the surface of the substrate by wiping the surface of the substrate while rotating around an axis parallel to the surface of the substrate such as a semiconductor wafer, and processes the substrate while contacting the substrate pen parts on the surface, and a substrate processing apparatus using at least any one of them. Background technique [0002] In recent years, along with miniaturization of semiconductor devices, processing of substrates having a fine structure (substrates on which films of various materials having different physical properties are formed) has been performed. For example, in the damascene wiring formation process of filling the wiring grooves formed in the substrate with metal, after the damascene wiring is formed, the excess metal is polished and removed by a substrate polishing device (CMP device), and variou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67
CPCH01L21/67017H01L21/67046B08B3/10
Inventor 石桥知淳
Owner EBARA CORP
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