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LED packaging structure and its packaging method

A technology of LED encapsulation and encapsulation method, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of low light efficiency and achieve high light efficiency

Active Publication Date: 2018-02-13
珠海雷士照明有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This packaging structure has low light efficiency due to the multiple reflections of light by the vertical plastic material 21 on the peripheral side to generate heat.

Method used

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  • LED packaging structure and its packaging method
  • LED packaging structure and its packaging method
  • LED packaging structure and its packaging method

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Experimental program
Comparison scheme
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Embodiment Construction

[0037] The present invention will be described in detail below with reference to the drawings and in conjunction with the embodiments. It should be noted that the following embodiments and the features in the embodiments can be combined with each other if there is no conflict.

[0038] image 3 It is a schematic structural diagram of the LED packaging structure in one of the embodiments of the present invention. As shown in the figure, the LED packaging structure includes: a reflective structure 20, an LED flip chip 10, and a packaging glue 30. The reflective structure 20 is an injection molded part, and the reflective structure 20 has a cavity 21. The upper end surface 22 and the lower end surface 23 of the structural member 20 are respectively provided with a top opening 21 a and a bottom opening 21 b communicating with the cavity 21. Preferably, the longitudinal section of the inner wall 25 of the cavity 21 is in an inverted eight shape, and the inner wall 25 of the cavity 21...

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Abstract

The invention discloses an LED packaging structure and a packaging method thereof. The LED packaging structure comprises a reflection structural member, an LED flip chip and a packaging colloid. The reflection structural member is provided with a cavity, and the upper end surface and the lower end surface of the reflection structural member are respectively provided with a top opening and a bottom opening which are communicated with the cavity; the LED flip chip is arranged in the cavity, and the electrode surface of the LED flip chip faces the bottom opening; and the packaging colloid is arranged in the cavity to package the LED flip chip. According to the invention, light emitted by the LED flip chip can be directly emitted out from the bottom opening, part of light emitted upwards can be directly emitted out through the packaging colloid, and the other part of light emitted upwards is projected to the inner wall of the cavity and can also penetrates through the fluorescent packaging colloid after being reflected, so that the integral light efficiency is high.

Description

Technical field [0001] The present invention relates to the field of semiconductor technology, in particular to an LED packaging structure and a packaging method thereof. Background technique [0002] As a fourth-generation lighting source, LED has significant energy saving and lifespan advantages. [0003] LED packaging is a key link to obtain high-quality LED lighting sources. The existing flip-chip packaging methods are as follows: One is to use fluorescent packaging gel (a mixture of phosphor and silica gel) 2 directly on the periphery of the flip chip 1. And top for packaging (e.g. figure 1 (Shown), due to the uneven mixing of the phosphor powder, the stress during cutting causes a high rejection rate of the product. The second is that the peripheral side of the flip chip 1 is sealed with a vertical plastic material 3, and the top is sealed with a fluorescent packaging glue 4 (such as figure 2 Shown). This packaging structure has low light efficiency due to the multiple ref...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/60
Inventor 王冬雷邓玉昌苏方宁
Owner 珠海雷士照明有限公司