Automobile diode device and manufacturing method thereof

A diode and automotive technology, used in semiconductor/solid-state device manufacturing, electrical solid-state devices, semiconductor devices, etc., can solve problems such as reduced impact resistance and reliability, increased probability of contamination, and infiltration into plastic packages, and achieves consistency. Good, guaranteed reflow resistance, low cost effect
CN105590907AInactive Publication Date: 2016-05-18捷捷半导体有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
捷捷半导体有限公司
Publication Date
2016-05-18
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention relates to an automobile diode device comprising a lead framework, a diode chip, and an in-connection strap which are successively arranged. The lead framework comprises a lead framework pin and a lead framework base plate. The in-connection strap comprises an in-connection strap main body and an in-connection strap pin. Space is kept between the in-connection trap pin and the lead framework pin. The in-connection strap pin is provided with a through hole. The through hole is provided with a pin solder block therein. The space between the in-connection strap pin and the lead framework pin is filled up with the melted pin solder block in the in-connection strap through hole. The invention also relates to the manufacturing method of the diode device mentioned above. The method comprises following steps: an electrode soldering lug A, a diode chip, an electrode soldering lug B and the in-connection strap are successively mounted on the lead framework base plate; the pin solder block is put into the through hole in the in-connection strap pin; the work piece is put in a graphite smelting device and sintered; then epoxy resin encapsulating is used for product package. The diode device has advantages such as good conformity, high reliability, and strong impact resistance.
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Description

Technical field

[0001] The invention relates to the field of diode devices, in particular to a diode device for automobiles and a manufacturing method thereof. Background technique

[0002] Automotive diode devices are protective devices for automotive electronic equipment and systems. With the high reliability requirements of automotive electronic equipment and the working mode of reverse transient high-energy shocks when automotive diode devices work, more advanced automotive diode devices are proposed. High demands.

[0003] At present, the packaging of automotive diode device products mainly adopts the following methods:

[0004] 1. The inner lead integrated bending structure, the structure diagram is as follows figure 1 As shown, the manufacturing process is as follows: spot solder paste on the bottom plate of the lead frame, assemble the chip, spot solder paste on the chip and the lead frame pins, assemble the inner lead, and sinter the whole at one time. It has the advantage...

Claims

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