Automobile diode device and manufacturing method thereof

Abstract

The invention relates to an automobile diode device comprising a lead framework, a diode chip, and an in-connection strap which are successively arranged. The lead framework comprises a lead framework pin and a lead framework base plate. The in-connection strap comprises an in-connection strap main body and an in-connection strap pin. Space is kept between the in-connection trap pin and the lead framework pin. The in-connection strap pin is provided with a through hole. The through hole is provided with a pin solder block therein. The space between the in-connection strap pin and the lead framework pin is filled up with the melted pin solder block in the in-connection strap through hole. The invention also relates to the manufacturing method of the diode device mentioned above. The method comprises following steps: an electrode soldering lug A, a diode chip, an electrode soldering lug B and the in-connection strap are successively mounted on the lead framework base plate; the pin solder block is put into the through hole in the in-connection strap pin; the work piece is put in a graphite smelting device and sintered; then epoxy resin encapsulating is used for product package. The diode device has advantages such as good conformity, high reliability, and strong impact resistance.

Description

Technical field [0001] The invention relates to the field of diode devices, in particular to a diode device for automobiles and a manufacturing method thereof. Background technique [0002] Automotive diode devices are protective devices for automotive electronic equipment and systems. With the high reliability requirements of automotive electronic equipment and the working mode of reverse transient high-energy shocks when automotive diode devices work, more advanced automotive diode devices are proposed. High demands. [0003] At present, the packaging of automotive diode device products mainly adopts the following methods: [0004] 1. The inner lead integrated bending structure, the structure diagram is as follows figure 1 As shown, the manufacturing process is as follows: spot solder paste on the bottom plate of the lead frame, assemble the chip, spot solder paste on the chip and the lead frame pins, assemble the inner lead, and sinter the whole at one time. It has the advantage...

AI Technical Summary

Problems solved by technology

It has the advantage of adopting a split-type inner lead structure, which avoids the thickness deviation of the solder layer between the diode chip and the inner lead, but increases the process steps, increases the probability of product contamination, and increases the cost; the temperature of the solder paste for two sinterings is different, The temperature of the second sintered solder paste is close to the reflow temperature during the product application assembly process, which may cause the second sintered solder paste of the product to melt during reflow soldering and penetrate into the plastic package, resulting in the impact resistance of the product. reduction in reliability

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