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Method for processing hole by laser

A laser processing and laser technology, used in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of poor roundness and cross-section effect, burrs block small holes, and the cutting section is not rough enough and smooth, etc., to improve the processing quality. efficiency, improve processing efficiency, and avoid the effect of poor processing

Active Publication Date: 2016-05-25
HANS LASER TECH IND GRP CO LTD
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Problems solved by technology

However, since the heat generated by laser cutting in laser processing cannot be taken away by the gas injected by the laser head in time, the residual heat will continue to accumulate and deform the metal sheet to be processed. The effect is poor, for example, there are many burrs, or even the burrs will block the small holes, or the cutting section is not smooth enough, which will affect the processing yield

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  • Method for processing hole by laser
  • Method for processing hole by laser
  • Method for processing hole by laser

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Embodiment Construction

[0021] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0022] see figure 1 and figure 2 , the method for adopting laser machining hole of one embodiment, the laser cutting head 100 that it adopts comprises laser connector 10, collimating mirror base 20, focusing mirror base 30, protective mirror base 50, nozzle 60, air pipe joint 70, follow-up assembly 80 and focus adjustment assembly 90. Laser connector 10, collimator mirror holder 20, focusing mirror holder 30, protection mirror holder 50, nozzle 60 are conn...

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Abstract

The invention relates to a method for processing a hole by laser. The method comprises the following steps: a laser cutting head and a first positioning point on a to-be-processed material are spaced for a preset processing distance, laser is focused to the first positioning point so as to form a first starting hole in the to-be-processed material; the laser is controlled by the laser cutting head to start to move from the first starting hole along a processing trace line, and is terminated at the first starting hole, so that a first cutting hole is formed in the to-be-processed material; the laser cutting head and a second positioning point which is formed in the to-be-processed material and is different from the first positioning point are spaced for a processing distance, and laser is focused on the second positioning point, so that a second positioning hole is formed in the to-be-processed material. The method for processing a hole by adopting laser has a high processing yield.

Description

technical field [0001] The invention relates to a laser processing method, in particular to a method for processing holes by using a laser. Background technique [0002] In the process of industrial production, it is often necessary to process small holes on the plate, such as round holes with a diameter of less than 1 mm. At present, there are generally three ways to process small holes: one is to use CNC (computer numerical control) for processing. CNC needs to use cutters such as milling cutters to cut plates to realize processing. The processing speed is relatively slow and it is easy to cause tool wear. Another way is to carry out chemical corrosion on the metal plate for processing. However, chemical corrosion is very polluting to the environment, and chemical corrosion cannot process metals resistant to chemical corrosion. The third way is to use laser processing. However, because the heat generated by laser cutting in laser processing cannot be taken away by the ga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/08B23K26/14B23K26/382
CPCB23K26/08B23K26/1438B23K26/382
Inventor 龚成万宋世宇刘朋林陈育钦高云峰
Owner HANS LASER TECH IND GRP CO LTD
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