Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor cavity package using photosensitive resin

A technology of semiconductors and resins, applied in semiconductor devices, processes for producing decorative surface effects, measuring devices, etc., can solve problems such as complex structures, assembly processes, and high costs, and achieve the effect of saving batch processing and cost

Inactive Publication Date: 2016-05-25
TEXAS INSTR INC
View PDF0 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the small size and high sensitivity of MEMS, packaging usually has a complicated structure and assembly process and high cost, even for plastic packages, compared to packages of common semiconductor devices

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor cavity package using photosensitive resin
  • Semiconductor cavity package using photosensitive resin
  • Semiconductor cavity package using photosensitive resin

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0032] Figure 1A and 1B An exemplary embodiment of the present invention is illustrated, a packaged device generally designated 100 comprising a semiconductor having an embedded or attached microelectromechanical system (MEMS) device 102 exposed to the environment through an opening of the package. Chip 101. MEMS can have any shape, but for simplicity in Figure 1B is shown as having a circular region. Such as Figure 1B As illustrated in , the opening of the exemplary embodiment has a circular perimeter, and the diameter of the opening is designated 110 . In other embodiments, the opening of the MEMS may have a rectangular or square perimeter, or any other suitable polygonal or contoured perimeter. Figure 1A The exemplary embodiment depicted in further has an encapsulation comprising an inverted taper with diameter 111 as the wide and smooth start of the opening. E.g figure 2Other embodiments depicted in have openings with straight walls.

[0033] Figure 1A and 1B ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to a semiconductor cavity package using photosensitive resin. A packaged device (100) is provided with a semiconductor chip (101) with a MEMS device (102) in the central chip area, wherein the package includes a light-sensitive first (150) and an opaque second (160) polymerized compound. The second compound (160) encapsulates the chip peripheral areas with the terminals (103) and wire bonds (130), and forms a sidewall (160a, diameter 112) around the un-encapsulated central area. The first compound (150) continues from the sidewall inward as a frame (inner diameter 110) around the un-encapsulated central area.

Description

technical field [0001] Embodiments of the present invention relate generally to the field of semiconductor devices and processes, and more particularly to structures and methods of manufacturing cavity packages using photosensitive resins. Background technique [0002] The various products collectively referred to as microelectromechanical systems (MEMS) devices are small, lightweight devices on the micrometer scale that may have mechanically moving parts and often movable power and controls, or that may respond to thermal, acoustic, or light energy. sensitive parts. MEMS have been developed to sense mechanical, thermal, chemical, radiation, magnetic, and biomass and inputs, and to generate signals as outputs. Examples of MEMS include mechanical sensors such as pressure sensors including microphone diaphragms and inertial sensors such as accelerometers coupled to the chip's integrated electronic circuitry. Mechanical sensors respond to and measure pressure, force, torque, ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B81B7/00B81C1/00
CPCH01L2924/181H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/48465H01L2224/73265H01L2224/83192H01L2224/92247H01L2224/97H01L2924/1815H01L2224/45144B81C1/0023H01L2924/00012H01L2924/00014H01L2924/00
Inventor 中西腾
Owner TEXAS INSTR INC