Substrate fixing method and device, semiconductor processing equipment

Abstract

The invention provides a substrate fixing method, a substrate fixing device and semiconductor processing equipment. The substrate fixing method at least comprises the following steps: S1, placing a substrate on an electrostatic chuck; S2, overlying an overlying element on the substrate; and S3, applying a direct voltage to the electrostatic chuck to fix the substrate to the electrostatic chuck through electrostatic adsorption. By using the substrate fixing method, the substrate fixing device and the semiconductor processing equipment provided by the invention, the problem that absorption of a substrate of poor smoothness by use of an electrostatic chuck directly is of low success rate in the prior art and the problem that the substrate temperature uniformity and process quality are poor due to the adoption of a mechanical fixing mode in the prior art are solved.

Description

technical field [0001] The invention belongs to the technical field of microelectronic processing, and in particular relates to a substrate fixing method and device, and semiconductor processing equipment. Background technique [0002] Etching equipment is one of the important equipment required in the manufacturing process of integrated circuits, which is used to complete the etching process on the substrate. [0003] figure 1 It is a schematic diagram of the structure of the reaction chamber of a typical etching equipment. see figure 1 , the reaction chamber 10 includes an electrostatic chuck 11, a coil 12, an air intake device, an exhaust device, a thimble lifting mechanism, and the like. Wherein, the electrostatic chuck 11 is arranged at the bottom of the reaction chamber 10 for fixing the substrate S on the upper surface thereof by means of electrostatic adsorption. The coil 12 is arranged above the dielectric window 13 on the top of the reaction chamber 10, and is ...

AI Technical Summary

Problems solved by technology

[0007] The present invention aims to solve at least one of the technical problems existing in the prior art, and proposes a substrate fixing method and device, and semiconductor processing equipment, which can not only solve the problem of poor flatness caused by direct electrostatic chucking in the prior art. The poor substrate has a low success rate of adsorption, and it can also solve the problem of poor substrate temperature uniformity and process quality caused by mechanical fixation in the prior art

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