A kind of negative expansion material and its preparation method and application
A technology of negative expansion materials and bulk materials, applied in the field of MnGe-based negative expansion materials, can solve the problems of low electrical/thermal conductivity, low mechanical properties, narrow working temperature range, etc., and achieve the effect of overcoming poor mechanical properties and excellent mechanical properties
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Embodiment 1
[0049] The preparation chemical formula is MnCoGe 1-x In x (x=0.005, 0.01, 0.015, 0.020, 0.025), Mn 1-x In x CoGe (x=0.01, 0.02, 0.025, 0.03) and MnCo 1-x In x Ge x (x=0.005, 0.01, 0.015, 0.02, 0.03) negative expansion materials.
[0050] 1) Weigh the raw materials respectively according to the above chemical formula.
[0051] 2) Put the raw materials prepared in step 1) into the electric arc furnace respectively, and vacuumize to 3×10 -3 Above Pa, after cleaning twice with the usual high-purity argon (purity 99.996wt%) cleaning method, under the protection of 1 atmospheric pressure of high-purity argon (purity 99.996wt%), the arc is started and the melting is repeated 3 times. The melting temperature is 2000°C. After the smelting is finished, it is cooled in a copper crucible to obtain a cast alloy ingot.
[0052] 3) Wrap the alloy ingots prepared in step 2) with metal molybdenum sheets respectively, and seal them in a vacuum quartz tube (vacuum degree is 1×10 -4 Pa...
Embodiment 2
[0059] Preparation of Mn 1-x CoGe (x=0.03, 0.035, 0.045); MnCo 1-x Ge (x=0.01, 0.02; MnCoGe 1-x (x are 0.01, 0.02, 0.03, 0.04, respectively).
[0060] Prepare the material according to the same method as in Example 1, the difference is that the chemical formula of the material is Mn 1-x CoGe, MnCo 1-x Ge, MnCoGe 1-x , where for the component Mn 0.97 Two kinds of molding pressures (1152MPa and 845MPa) were used in CoGe, step 5), and the effects of different molding pressures on strain during the bonding process were compared.
Embodiment 3-11
[0062] Prepare the material of embodiment 3-11 according to the same method as embodiment 1, the difference is that the chemical formula of the material is as follows respectively:
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