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Orthogonality determination method for direct writing system motion platform

A motion platform and measurement method technology, applied to measurement devices, instruments, optical devices, etc., can solve the problems of long tool cycle, high cost, and difficulty in obtaining testing equipment or testing tools, achieving low cost and fast cycle time. Effect

Active Publication Date: 2016-06-01
SVG TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In general, there are two main problems in the current technology: one is that the detection process requires the use of third-party equipment, the tool cycle is long, and the cost is high
Second, for the detection of large format and high precision platforms, it is difficult to obtain detection equipment or detection tools

Method used

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  • Orthogonality determination method for direct writing system motion platform
  • Orthogonality determination method for direct writing system motion platform
  • Orthogonality determination method for direct writing system motion platform

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Embodiment Construction

[0027] Preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0028] In order to achieve the purpose of the present invention, as Figure 1 to Figure 4 As shown, in one of the embodiments of the present invention, a method for measuring the orthogonality of the motion platform of the direct writing system is provided, which is characterized in that it includes the following steps:

[0029] Step 1, designing a lithography file so that the lithography file has positioning mark points A, B, C, D at the four corners of its surface;

[0030] Step 2, fixing a blank substrate on the motion platform of the direct writing system;

[0031] Step 3, according to the lithography file of step 1, perform direct write exposure on the blank substrate;

[0032] Step 4, record the XY direction of the motion platform corresponding to each side of the exposed substrate, and then remove the exposed substrate for developmen...

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PUM

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Abstract

The invention discloses an orthogonality determination method for a direct writing system motion platform. The method comprises the following steps: (1) designing a photolithography file, and forming positioning mark points at four corners; (2) fixing a substrate on the motion platform; (3) carrying out direct writing exposure on the substrate according to the photolithography file; (4) recording XY directions, corresponding to the motion platform, of various sides of the substrate and then carrying out developing, cleaning and drying; (5) rotating the substrate 90 degrees and then fixing the substrate on the motion platform of a direct writing system; (6) moving the motion platform, locating the four positioning mark points at the center positions of a CCD respectively, and recording the corresponding position coordinates; and (7) forming a parallelogram by connection lines of the position coordinates and calculating the orthogonality of the motion platform. Compared with the prior art, third-party equipment or tool is not needed, so that the method disclosed by the invention is short in period, simple, convenient, low in cost and suitable for correction of large-width platforms.

Description

technical field [0001] The invention belongs to the technical field of laser direct writing lithography equipment, in particular relates to the precision measurement and correction of a precision motion platform, and provides a method for measuring the orthogonality of a motion platform of a direct writing system. Background technique [0002] Currently, in the laser direct writing lithography system, the orthogonality deviation of the motion platform determines the quality of the geometric orthogonality of the overall layout of the lithography product. There are more or less orthogonal deviations in the motion platform. Take the lithography mask as an example: if the error is too large, on the one hand, the lithography product cannot meet the geometric orthogonality requirements of the designed graphics; on the other hand, the existing The mask produced by one equipment often needs to be overlaid with the mask produced by other equipment, and the deviation of orthogonality ...

Claims

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Application Information

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IPC IPC(8): G03F7/20G01B11/26
CPCG01B11/26G03F7/20
Inventor 朱鹏飞浦东林陈林森朱鸣
Owner SVG TECH GRP CO LTD
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