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Headset with liquid bags arranged on ear pads and head beam

A headphone and headband technology, applied in earpiece/headphone accessories, earphone manufacturing/assembly, loudspeaker, etc., can solve the problems of ear pads that cannot be improved in appearance, hot feeling, and difficult for users to replace, etc.

Inactive Publication Date: 2016-06-01
张清华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] However, in practical application, we found that there are still the following defects: 1. The inside of the ear pad and the outer cladding of the head beam are made of soft but poor thermal conductivity sponge and other materials. When using the earphone under the condition of high ambient temperature, the skin contact part is very difficult. 2. The filling sponge of the ear pads is not an ideal sealing material for the sound cavity, and the effect of isolating the external noise and the sound inside the sound cavity is relatively poor; 3. The appearance of the ear pads and the head beam is due to the Constrained by the existing structure, its appearance cannot be improved, and the style is single and unsightly; 4. At present, when earphones are produced, the ear pads and cushioning composite material layers are only produced with sponge linings suitable for use at normal temperatures, and users generally do not have Replacement options Ear pads and cushioning composite layer for summer use; ear pads attached to support mesh panel by elastic skirt but elastic skirt attached to ear pads by stitching, cushioned composite layer to elastic headgear The connection is generally made in a way that is difficult to disassemble, and it is even more difficult for users to replace

Method used

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  • Headset with liquid bags arranged on ear pads and head beam
  • Headset with liquid bags arranged on ear pads and head beam
  • Headset with liquid bags arranged on ear pads and head beam

Examples

Experimental program
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Effect test

Embodiment Construction

[0080] The present invention will be described in further detail below in conjunction with the accompanying drawings, but this description will not constitute a limitation to the present invention.

[0081] Such as figure 1 The direction marking diagram of a headphone with a liquid bag provided on the ear pad and the head beam of the present invention is shown. The inner side refers to the direction from the headphone main body (earmuff 1, elastic head frame 2, cooling liquid bag 3) to the human head The direction of the center; the outer side refers to the direction from the earphone body (earmuffs 1, elastic head frame 2, cooling fluid bag 3) to the external environment, which is opposite to the inner direction; the inner side refers to the direction of the object facing the human head The surface on which it is located; the outer surface refers to the surface where the object faces the external environment, and its direction is opposite to that of the inner surface.

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Abstract

The invention provides a headset with liquid bags arranged on ear pads and a head beam. The headset has the advantages of rapid heat dissipation, little possibility of temperature rise, better vocal cavities and easiness in replacing the ear pads and the head beam. According to the technical schemes of the invention, each ear pad is structurally provided with an annular liquid bag ear pillow, a detachable connection fixing device and a sound-transmitting mesh fabric from inside to outside, wherein the annular liquid bag ear pillow comprises an annular shaping ring; the outer sides of ear cover shells are provided with heat dissipation devices; the thermal conductivity of supporting mesh plates, the ear cover shells and the heat dissipation device is high; the inner side or / and outer side of an elastic head frame is provided with one or more cooling liquid bag; the annular shaping rings and the cooling liquid bags are filled with liquid or / and colloid, a plurality of spherical particles and / or a granular decorative composite material body; the detachable connection fixing devices can be devices such as magnets or / and Velcro or / and annular elastic skirts, which can be removed manually or removed by using a manual tool.

Description

technical field [0001] The invention relates to a headphone, in particular to an ear pad, a head beam, a supporting net plate and a shell part of the earmuff of the headphone. Background technique [0002] The ear pads of the headset are also called earmuffs, which can buffer the pressure of the headband and are also the part that directly attaches to the skin, which also has a direct impact on the comfort of wearing. Historically, it has been made of rubber, cloth, goose down and other materials. At present, the headsets on the market are mainly made of sponge as the main material, and the surface material is wrapped with flannelette, animal leather, artificial leather, and bionic leather products with protein as the main raw material. Different materials have different performances. In addition to the comfortable function, the ear pad is also an important part of the acoustic structure. It can surround the space between the driver and the ear to form a sealed or semi-clos...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R1/10
CPCH04R1/1066H04R2201/105
Inventor 不公告发明人
Owner 张清华
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