Intelligent temperature-control semiconductor cold-compress instrument

An intelligent temperature control and semiconductor technology, which is applied to cooling appliances for treatment, heating appliances for treatment, contraceptives, etc., can solve the problems of ice packs being too cold, easy to fall off, and reduce the effect of cold compresses, etc., to achieve small thermal inertia , fixed and reliable, stable working effect

Inactive Publication Date: 2016-06-08
SOUTHEAST UNIV
View PDF7 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these new products have overcome some of the shortcomings of ordinary ice packs, what is not optimistic is that they also have common shortcomings: the temperature is uncontrollable, the ice pack is too cold at the beginning of use, frostbite may occur, and the low temperature is gradually lost in the later period, and the cold compress effect is not ideal.
[0004] The uncontrollable temperature of cold compress is a thorny problem that is difficult to solve clinically. In order to prevent accidental frostbite, some nurses will wrap multiple layers of cotton cloth or towel outside the ice pack to avoid adverse effects, but this greatly reduces the effe

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Intelligent temperature-control semiconductor cold-compress instrument
  • Intelligent temperature-control semiconductor cold-compress instrument
  • Intelligent temperature-control semiconductor cold-compress instrument

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0022] An intelligent temperature-controlled semiconductor cold compressing apparatus, a water cooling device 10, a thermally conductive base plate 16, and a semiconductor refrigerating sheet 15. The semiconductor refrigerating sheet 15 is arranged on the thermally conductive base plate 16, and the semiconductor refrigerating sheet 15 is arranged on the thermally conductive base plate 16 and the semiconductor refrigeration The cooling surface of the fin 15 is attached to the heat conducting bottom plate 16, and the water cooling head 13 in the water cooling device 10 is arranged on the heat dissipation surface of the semiconductor cooling fin 15.

[0023] The cold compress apparatus also includes:

[0024] Power switch 2, used to control lithium battery 1 to supply power to the cold compress;

[0025] Power indicator 3, used to indicate whether the battery power is too low;

[0026] Display temperature digital tube 4, used to reflect the actual temperature of the cold patch part in re...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

An intelligent temperature-control semiconductor cold-compress instrument is composed of a water cooling device, a heat-conducting bottom plate and a semiconductor refrigerating plate. The semiconductor refrigerating plate is arranged on the heat-conducting bottom plate, the refrigerating surface of the semiconductor refrigerating plate is attached to the heat-conducting bottom plate, and water cooling heads of the water cooling device are arranged on the heat-dispersing surface of the semiconductor refrigerating plate. According to the intelligent temperature-control semiconductor cold-compress instrument, the semiconductor refrigerating plate serves as a cold source, and an operator can control the working state of the cold-compress instrument through a human-computer interaction interface, so that the effect that the cold-compress temperature and time are adjustable is achieved. A temperature sensor is used for precisely controlling the cold-compress temperature. A cold-compress patch part of the cold-compress instrument is smaller in size and is attached to surface skin of an affected part through a silica gel sticking patch, and the advantages of conveniently observing the skin condition, meeting the requirement of small wound cold compress and the like are achieved. The cold-compress instrument does not need an external power supply and can be applied to hospital treatment and outdoor on-site rescue.

Description

technical field [0001] The invention relates to a cold compress device, in particular to an intelligent temperature-controlled semiconductor cold compress device. Background technique [0002] Cold compress can reduce pain, swelling, inflammatory reaction, hematoma, and reduce energy consumption of the body. However, the traditional cold compress method is to pour crushed ice cubes into rubber ice packs. However, there are problems such as troublesome production, heavy weight, not easy to fix, small contact area, unsustainable temperature, frequent replacement, and prone to frostbite. Nurses generally find that the ideal ice compress effect cannot be achieved in clinical use. [0003] Many improvements have emerged in recent years to increase the effectiveness of cold compresses. ①The use of self-cooling chemical ice packs has the advantages of light weight, ready-to-use, free-to-shape, easy operation, and avoiding cross-infection; It has the advantages of increasing the ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): A61F7/00
CPCA61F7/00A61F2007/0056
Inventor 王兴松田梦倩马振兴
Owner SOUTHEAST UNIV
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products