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Conductive film-like adhesive, film-like adhesive attached dicing tape and manufacturing method of semiconductor device

A conductive film and adhesive technology, which can be used in semiconductor/solid-state device manufacturing, conductive adhesives, film/sheet adhesives, etc., and can solve problems such as high heat generation

Active Publication Date: 2016-06-08
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

There is always current flowing in the power semiconductor device, so it generates a lot of heat

Method used

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  • Conductive film-like adhesive, film-like adhesive attached dicing tape and manufacturing method of semiconductor device
  • Conductive film-like adhesive, film-like adhesive attached dicing tape and manufacturing method of semiconductor device
  • Conductive film-like adhesive, film-like adhesive attached dicing tape and manufacturing method of semiconductor device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0142] Hereinafter, the present invention will be described in detail using examples, but the present invention is not limited to the following examples unless the gist of the configuration is not exceeded.

[0143] Components used in Examples will be described.

[0144] Thermoplastic resin: Teisan Resin SG-70L manufactured by Nagase Chemtex Co., Ltd. (acrylic copolymer having carboxyl and hydroxyl groups, Mw: 900,000, acid value: 5 mgKOH / g, glass transition temperature: -13°C)

[0145] Epoxy resin 1: EOCN-1020-4 manufactured by Nippon Kayaku Co., Ltd. (epoxy resin with an epoxy equivalent of 198 g / eq. and solid at 25° C.)

[0146] Epoxy resin 2: JER828 manufactured by Mitsubishi Chemical Corporation (an epoxy resin having a bisphenol-type skeleton that is liquid at 25° C., and an epoxy equivalent of 184 g / eq. to 194 g / eq.)

[0147] Epoxy resin 3: EPICLONEXA-4816 manufactured by DIC Corporation (an epoxy resin with an epoxy equivalent of 403 g / eq. and liquid at 25° C.)

[01...

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Abstract

The invention provides a conductive film-like adhesive and film-like adhesive attached dicing tape which are higher in heat dissipation property after being cured, and relates to the conductive film-like adhesive. The ratio of the first heat conductivity of a cured substance, which is obtained by heating and curing hte adhesive, to the second heat conductivity before heating is higher than 2.0 (first conductivity / second conductivity).

Description

technical field [0001] The present invention relates to a conductive film adhesive, a dicing tape with the film adhesive, and a method for manufacturing a semiconductor device. Background technique [0002] In the manufacture of semiconductor devices, the method of bonding semiconductor elements to adherends such as metal lead frames (the so-called diebonding method) has gradually transitioned from the conventional gold-silicon eutectic to the use of solder and resin paste. method of feeding. Conductive resin pastes are now sometimes used. [0003] However, in the method using the resin paste, there is a problem that the conductivity is lowered due to voids, the thickness of the resin paste is not uniform, or the pad is contaminated due to overflow of the resin paste. In order to solve these problems, a film-like adhesive containing a polyimide resin is sometimes used instead of a resin paste (for example, see Patent Document 1). [0004] Film adhesives comprising acrylic...

Claims

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Application Information

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IPC IPC(8): C09J7/00C09J9/02H01L21/60
CPCH01L2224/45144H01L2224/48091H01L2224/73265H01L2924/181H01L2924/00012H01L2924/00014H01L2924/00
Inventor 菅生悠树木村雄大襖田光昭
Owner NITTO DENKO CORP