Mobile terminal with fingerprint sensor packaging structure and preparation method thereof

Abstract

The present invention provides a mobile terminal with a fingerprint sensor packaging structure and a preparation method thereof. A fingerprint sensor assembly in the mobile terminal comprises two independent portions. The first portion is a sensor injection-molded part, which comprises a semiconductor sensor die and a sensing pixel array on the surface of the semiconductor sensor die, a base which is used for bearing the semiconductor sensor die and is electrically connected with pins of the sensor die, a bonding lead used for electrically connecting the pins of the sensor die and base pins, and an injection-molded material wrapping the sensor die (including the sensing pixel array on the surface), the bonding lead and the base. The second portion comprises a substrate which is used for bearing the sensor injection-molded part and is electrically connected with the sensor injection-molded part, a connector connected with the substrate, and a metal frame embedded to the periphery of the surface of the sensor injection-molded part. According to the fingerprint sensor assembly of the mobile terminal, size of a fingerprint sensor module can be largely reduced, and the fingerprint sensor assembly is especially suitable for a mobile terminal or device having severe requirements on spatial scale.

Description

technical field [0001] The present invention relates to the field of semiconductor packaging, in particular to a capacitive semiconductor fingerprint sensor packaging technology and related methods, and more particularly, to a mobile terminal with a fingerprint sensor packaging structure and a preparation method thereof. Background technique [0002] In recent years, with the rise of Apple's iphone5S fingerprint recognition device TouchID, there has been a wave of fingerprint recognition in the field of smart phones. [0003] However, the fingerprint identification solution in the prior art needs to install a fingerprint identification component in a groove on the front or back of the mobile phone casing, so that the collection surface of the fingerprint identification component is exposed, so as to be in contact with the finger. The slotting scheme of the casing, especially the front panel needs to open a hole in the touch screen, which not only increases the process steps ...

AI Technical Summary

Problems solved by technology

[0003] However, the fingerprint recognition solution in the prior art needs to install a fingerprint recognition component in a slot on the front or back of the mobile phone casing, so that the collection surface of the fingerprint recognition component is exposed, so that it can be in contact with the finger

The slotting scheme of the casing, especially the front panel needs to open holes in the touch screen, which not only increases the process steps of the touch screen, but also affects the overall structure and appearance of the terminal device, making the ID design complicated

[0004] Moreover, due to the limitation of the design principle and structure of the capacitive fingerprint sensor in the prior art, its limit detection sensitivity can only reach 100um

Although the detection sensitivity of the radio-frequency fingerprint sensor is higher than that of the capacitive type, it needs radio-frequency electrodes, and the touch-screen processing technology is difficult to produce conductive radio-frequency electrodes on the surface of the touch-screen cover plate, making the existing touch-screen sensitive to the radio-frequency fingerprint sensor. Support is almost impossible

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