Copper-and-aluminum combined radiator

A combined, radiator technology, applied in the direction of instruments, electrical digital data processing, digital data processing components, etc., can solve the problems that the radiator cannot meet the heat dissipation requirements, the copper material is easily oxidized, and the thermal conductivity of copper is reduced, and the structure is achieved. Novel, good heat dissipation, optimized combination effect

Inactive Publication Date: 2016-06-15
JIANGSU WEICHUANG RADIATOR MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Existing CPU radiators are generally made of aluminum or aluminum alloy. Aluminum material has very good thermal conductivity, but compared with copper material, copper has better thermal conductivity, and the thermal conductivity of copper is close to twice that of alumin

Method used

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  • Copper-and-aluminum combined radiator
  • Copper-and-aluminum combined radiator

Examples

Experimental program
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Embodiment Construction

[0014] exist figure 1 Among them, the aluminum base 1 of the copper-aluminum combined heat sink is provided with a heat-conducting copper column 2, one end of the heat-conducting copper column 2 is located in the same plane as the bottom surface of the aluminum base 1, and the other end of the heat-conducting copper column 2 passes through the An aluminum base 1 is provided, and an aluminum heat sink 3 integrated with the aluminum base 1 is provided above the aluminum base 1. The heat sink 3 is centered on the heat-conducting copper column 2, and the heat-dissipating fin 3 and the heat-conducting copper column 2 are closely combined, and a fan 4 is arranged above the heat sink 3 .

[0015] figure 2 It is a schematic diagram of the structure of the present invention.

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Abstract

Provided is a copper-and-aluminum combined radiator. An aluminum substrate is internally provided with a heat-conducting copper column, the other end of which penetrates out of the aluminum substrate. An aluminum radiating fin integrated with the aluminum substrate is arranged above the aluminum substrate and closely combined with the heat-conducting copper column with the heat-conducting copper column as the center. The copper-and-aluminum combined radiator has following beneficial effects: by fully making use of difference between cooper and aluminum in heat conduction performance and cost, combination is optimized; a structure is novel; and good radiating performance is obtained.

Description

technical field [0001] The invention relates to a CPU heat sink, in particular to a heat sink which adopts copper-aluminum combination to dissipate heat. Background technique [0002] Integrated circuits are heavily used in computer components. As we all know, high temperature is the enemy of integrated circuits; high temperature will not only lead to unstable operation of the system, shorten the service life, and may even burn some components; the heat that causes high temperature does not come from outside the computer, but from inside the computer, or integrated Inside the circuit; the function of the radiator is to absorb the heat and then dissipate it inside or outside the case to ensure that the temperature of the computer components is normal. Most heat sinks absorb heat by contacting the surface of the heat-generating components, and then transfer the heat to a distant place through various methods, such as the air in the chassis, and then the chassis transfers th...

Claims

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Application Information

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IPC IPC(8): G06F1/20
Inventor 刘大忠荀贵章
Owner JIANGSU WEICHUANG RADIATOR MFG
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