IC appearance inspection device

Abstract

The invention discloses an IC appearance inspection device comprising a feeding module, a first bearing tray moving orbit, a second bearing tray moving orbit, a portal frame, a bad product stacking module and a good product stacking module, wherein the first bearing tray moving orbit internally comprises two transportation modules for sequentially removing different bearing trays in the feeding module and delivering the different bearing trays into an inspection region within different time points; the second bearing tray moving orbit is in charge of transporting standby bearing trays; two sides of the portal frame are respectively provided with a first fetching module and a second fetching module, wherein the first fetching module is used for moving ICs on the bearing trays to the inspection region so that the ICs are inspected, and the second fetching module is used for exchanging the ICs between the bearing trays which are inspected and moved to a sorting position of the first bearing tray moving orbit and the standby bearing trays according to good products or bad products; and finally, the bearing trays bearing the good products or the bad products are delivered to the bad product stacking module and the good product stacking module so as to be collected. Therefore, the first bearing tray moving orbit can simultaneously bear two bearing trays, the other bearing tray can be sorted while one of the bearing trays is inspected, so that the inspection efficiency can be increased; and package and shipment can also be subsequently carried out in different ways according to indications of customers, so that the production efficiency is increased.

Description

technical field [0001] The invention relates to an inspection device, in particular to an IC (integrated circuit) appearance inspection device, which is a design capable of improving detection efficiency. Background technique [0002] In the production of chips, a disc-shaped wafer with circuits is cut into multiple chips, and then goes through several processes and packaging operations to complete the finished chip. In order to ensure the quality of the products, manufacturers will conduct inspections on the internal circuits of the chips, as well as inspections on the appearance and pin shape, and then sort out good and bad products. [0003] At present, the work of the IC appearance inspection device mainly includes two parts: appearance inspection and selection and classification. The appearance inspection includes at least two parts: pin inspection and appearance inspection. The pin inspection is mainly to check the Ball Grid Array (BGA) or For the defects of the leads...

AI Technical Summary

Problems solved by technology

At present, most of the appearance inspection devices of this kind are carried by the carrier plate, and then the appearance inspection and sorting are carried out in sequence. The appearance inspection operation needs to absorb each chip to the corresponding inspection module for inspection, which requires a long time. Increase the man-hours of sorting and sorting, resulting in the inability to effectively improve production efficiency

[0004] Furthermore, current IC appearance inspection devices usually only provide a single packaging method. For example, the IC is carried on a tray for inspection. After the inspection is completed, the packaging of good or defective products is collected through the tray. For example, if you change to using tubes to collect good products, you need to buy another packaging equipment. The packaging equipment can remove multiple stacked trays in sequence, and then suck individual ICs into the corresponding tubes. This is very important for manufacturers. , not only need to purchase an additional packaging equipment, but also need additional space in the plant to accommodate the packaging equipment

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