Double-line locked composite aluminium substrate of circuit board

Abstract

The invention discloses a double-line locked composite aluminium substrate of a circuit board, and belongs to the technical field of an aluminium-based circuit board. The aluminium substrate comprises an upper aluminium substrate and a lower aluminium substrate; the upper aluminium substrate and the lower aluminium substrate are connected through a bonding layer; the aluminium substrate also comprises a facial line and a bottom line; the facial line is arranged on one side surface of the upper aluminium substrate back on to the bonding layer; the bottom line is arranged on one side surface of the lower aluminium substrate back on to the bonding layer; and the upper aluminium substrate and the lower aluminium substrate are connected and fixed by the facial line and the bottom line in a double-line interlocked seam mode. The stress generated when the upper aluminium substrate and the lower aluminium substrate and the lower aluminium substrate are heated can be cancelled through applying an external force; the space of deformation generated by heat expansion is limited; the deformation degree is reduced; and therefore, the problem that the delamination rate generated when a tin dipping test is carried out with the existing composite aluminium substrate finished product can be solved.

Description

technical field [0001] The invention belongs to the technical field of aluminum-based circuit boards, and in particular relates to a double-wire locking composite aluminum substrate for circuit boards. Background technique [0002] In order to reduce the material cost of aluminum-based circuit boards, in the existing open literature, a sandwich composite method is generally adopted to reduce the consumption of aluminum boards. For example, a "multi-layer insulated metal-based circuit board" provided by the Chinese invention patent application publication number CN103442512A is provided with a resin insulating layer between every two adjacent metal substrates, and the increased resin insulating layer reduces the The thickness of the aluminum base plate can not only make the circuit board have excellent thermal conductivity, but also greatly reduce the production cost and facilitate production. However, this technical solution still has the following disadvantages: due to the...

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Problems solved by technology

[0004] The purpose of the present invention is to provide a double-wire locking composite aluminum substrate for circuit boards. By applying external force to offset the stress generated when the aluminum substrate is heated, the space for deformation caused by thermal expansion is limited, and the degree of deformation is reduced. The problem of high cracking rate occurred during the immersion tin test

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