Mixed-voltage high-frequency multilayer circuit board, manufacturing method thereof, and high-frequency electronic components

Abstract

The invention belongs to a mixed-voltage high-frequency multi-layer circuit board, a fabrication method thereof and a high-frequency electronic component, which are used for solving the problem of unreasonable design of the prior art. The fabrication method of the mixed-voltage high-frequency multi-layer circuit board comprises the following steps of A, material preparation; B, lamination; and C, copper plating. The mixed-voltage high-frequency multi-layer circuit board comprises a circuit board body, wherein a plurality of penetrating through holes are formed in the circuit board body and pass through the thickness direction of the circuit board body, a copper plating layer is arranged on the hole wall of each penetrating through hole, the circuit board body comprise two layers of polytetrafluoroethylene fiberglass fabric copper cladding foil plates, a plurality of polyimide thin film copper cladding layers are arranged between the two layers of polytetrafluoroethylene fiberglass fabric copper cladding foil plates and are sequentially laminated, and a circuit layer is arranged on at least one surface of each polyimide thin film copper cladding layer. The mixed-voltage high-frequency multi-layer circuit board has the advantages that the high-frequency dielectric property and the high-temperature resistant performance can be improved, and the inter-layer alignment accuracy can be improved.

Description

technical field [0001] The invention belongs to the technical field of circuit boards, and in particular relates to a mixed-voltage high-frequency multilayer circuit board, a manufacturing method thereof, and high-frequency electronic components. Background technique [0002] With the rapid development of the electronic information industry, the upgrading of electronic products is accelerating, the speed of digital calculation is getting faster and faster, the signal frequency is getting higher and higher, and the characteristics of high current resistance and high temperature resistance are required. Electronic products are becoming more and more integrated. , Miniaturization and multi-functional development, which puts forward more requirements for the circuit board industry in terms of technology, technology and materials. [0003] Especially for multi-layer circuit boards in the fields of aviation, aerospace, satellite communication, navigation, radar, electronic counter...

AI Technical Summary

Problems solved by technology

Ordinary Tg multilayer circuit boards are not suitable for the use of electronic products in these occasions due to their low temperature resistance, high dielectric constant, and large loss.

Secondly, ordinary Tg multilayer circuit boards have poor alignment accuracy between circuit layers, resulting in a high scrap rate and virtually increasing production costs.

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