Prepreg, circuit making method and hole filling method of substrate, and circuit board manufacturing method

A prepreg, manufacturing method technology, applied in chemical instruments and methods, circuit substrate materials, printed circuits, etc., can solve the problem of not being able to completely fill the pattern gap, etc., to promote clean production, reduce manufacturing costs, and solve technical limitations. Effect

Active Publication Date: 2018-06-05
NEW FOUNDER HLDG DEV LLC +2
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

As we all know, due to the limitations of prepreg processing technology and circuit board lamination technology, there is only part of the flowable resin in the prepreg, and the other part is glass cloth (ie: glass fiber) that strengthens the mechanical strength. To ensure reliability, the flowable resin cannot completely fill the graphic gap

Method used

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  • Prepreg, circuit making method and hole filling method of substrate, and circuit board manufacturing method
  • Prepreg, circuit making method and hole filling method of substrate, and circuit board manufacturing method
  • Prepreg, circuit making method and hole filling method of substrate, and circuit board manufacturing method

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Embodiment Construction

[0045] In order to understand the above-mentioned purpose, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that, in the case of no conflict, the embodiments of the present application and the features in the embodiments can be combined with each other.

[0046] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways than described here. Therefore, the protection scope of the present invention is not limited by the specific implementation disclosed below. Example limitations.

[0047] An embodiment of the first aspect of the present invention provides a prepreg (not shown in the figure), the components of which include resin, fiber and catalyst, wherein the resin, the fiber and the ...

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Abstract

The invention provides a prepreg, a circuit making method and a hole filling method of a substrate, and a circuit board manufacturing method. The prepreg includes resin, fiber and catalyst, wherein the resin, fiber and catalyst are mixed and arranged. The prepreg provided by the invention has simple structure, low manufacturing cost and good operability, can effectively reduce the manufacturing cost of circuit boards, realize the purpose of enterprise product optimization, and make the process of manufacturing difficult multilayer boards simpler.

Description

technical field [0001] The invention relates to the field of circuit board production and manufacturing, and more specifically, relates to a prepreg, a circuit manufacturing method for a substrate, a hole filling method for a substrate, and a circuit board manufacturing method. Background technique [0002] The ever-changing communication technology has brought people a lot of enjoyment, especially with the popularization of 3G and 4G, electronic products are developing towards multi-function and miniaturization. Traditional circuit board processing technology is facing thinner and smaller electronic products. The demand for products has become more and more inadequate. On the one hand, the miniaturization of electronic products requires higher and higher processing precision, and on the other hand, the low cost also brings great troubles to processing and manufacturing enterprises. [0003] Therefore, how to use simpler and cheaper technology to realize smaller and more co...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/08B32B27/06H05K1/03H05K3/18H05K3/42
Inventor 史书汉任敏柳小华
Owner NEW FOUNDER HLDG DEV LLC
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