Method and system for processing immersed workpiece by double laser light

A dual-laser, workpiece technology, applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., to achieve the effects of improving laser processing accuracy and workpiece quality, reducing thermal impact, and reducing thermal impact

Active Publication Date: 2016-07-06
GUILIN UNIV OF ELECTRONIC TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] It can be seen that the thermal influence of the laser processing process has buried the hidden danger of low stress brittle fracture when the workpiece is in service.

Method used

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  • Method and system for processing immersed workpiece by double laser light

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Embodiment Construction

[0024] Below in conjunction with accompanying drawing and embodiment the present invention is described in detail:

[0025] System embodiment of dual laser processing water immersion workpiece

[0026] The structure of the system embodiment of this double laser processing water immersion workpiece is as follows figure 1 As shown, the lower part of the water tank 3 of this example has a water inlet 1, and a water inlet valve 2 is installed on the water inlet, and the water tank 3 has a transparent glass top cover 4 that can seal its top. Install exhaust valve 8 on it. The water tank 3 is connected with a pressure measuring tube, and the pressure measuring tube is connected with a water pressure gauge 11 through a pressure measuring valve 12 . When the water tank 3 was filled with water, the water inlet valve 2, the exhaust valve and the pressure measuring valve 12 were all opened. When the system is working, the water inlet valve 2, the exhaust valve 8 and the pressure measu...

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Abstract

The invention discloses a method and a system for processing an immersed workpiece by double laser light. The method includes focusing the laser light A with the wavelength of 1064 nm on the surfaces of the workpiece in water and locally softening the heated workpiece; focusing the laser light B with the wavelength of 10640 nm on the water above the workpiece; breaking through the water by the aid of the laser light B to generate impact waves, enabling the impact waves to act on locally softened regions of the surfaces of the workpiece and removing softened materials so as to groove and process the workpiece. A focus point of the laser light A and a focus point of the laser light B are distanced from each other by hundreds of micrometers. Solid for generating the laser light A and the laser light B and a laser head of a CO2 gas laser device of the system are positioned above a water tank, the center line of laser beams A is a plumb line, the center line of laser beams B intersects with the laser beams A at the focus point of the laser light A on the upper surface of the workpiece, and an intersection angle of the center line of the laser beams B and the laser beams A is 10-30 degrees. The height of a worktable can be adjusted. The thicknesses of water layers on the surfaces of the workpiece are 1-3 millimeters. Compared with laser melt cutting processing, the system and the method have the advantages that the heating temperature of the laser light A is lower than melting points of the materials, accordingly, influence of local overheating can be reduced, and the quality of machined finished products can be guaranteed.

Description

technical field [0001] The invention relates to liquid-assisted laser processing technology, in particular to a method and system for processing water-immersed workpieces with dual lasers. Background technique [0002] As a minimal loss and precision processing method, laser processing is more and more widely used in the field of micro-scale processing. Laser processing mostly uses the thermal effect of the laser to locally heat the material to the melting point to melt, thereby removing part of the material and completing the etching process of the groove. [0003] All kinds of materials cannot avoid certain subtle organizational defects. In the process of changing the local material state and removing material by laser heating, the high temperature of the laser processing process inevitably affects a certain area around the grooving by heat. Under the stress gradient generated by local high heat, micro-cracks are easily induced by micro-structural defects in materials, e...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/402B23K26/122B23K26/14
CPCB23K26/1224B23K26/14B23K26/364B23K26/402B23K2103/56
Inventor 刘清原龙芋宏周嘉鲍家定毛建东刘鑫唐文斌
Owner GUILIN UNIV OF ELECTRONIC TECH
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