Integrated air-breathing ceramic package case

Abstract

The invention provides an integrated air-suction type ceramic packaging tube shell. The integrated air-suction type ceramic packaging tube shell further comprises a getter module which is designed integrally with the ceramic packaging tube shell; the getter module comprises a metal region and a getter material layer; the metal region is directly grown on the inner surface of the ceramic packaging tube shell; the getter material layer is grown on the metal region; a lead framework connected to the metal region is reserved at the interior of the ceramic packaging tube shell; and the metal region is communicated with an activation release pin at the outer part of the tube shell through the lead framework. According to the integrated air-suction type ceramic packaging tube shell, the air suction function of the ceramic packaging tube shell per se can be realized, the packaging processing steps of a traditional MEMS device can be simplified, the production efficiency is increased, the getter reliability also can be enhanced to enable the tube shell to have a capability of resisting to excellent mechanical shock; and in addition, the resistance in the metal region is controllable, so that relatively great resistance in the metal region can be realized, the temperature of the metal region is controlled exactly in the release process of the getter material layer, complete activation and complete release of the getter material layer are ensured, yield rate is improved, and the service life of the MEMS device is prolonged.

Description

technical field [0001] The invention relates to a packaging shell of MEMS devices, in particular to an integrated air-absorbing ceramic packaging shell. Background technique [0002] At present, MEMS sensors such as infrared thermal imaging and THz generally use ceramic shells to achieve high vacuum, constant temperature, and small-volume packaging. In order to realize the high-vacuum environment in the packaging structure, an independent getter device is generally installed in the tube shell to absorb the pollutants such as gas and moisture slowly released inside the packaging structure, so as to maintain the MEMS sensor working at 10 -1 ~10 -2 pa high vacuum environment. [0003] In the existing technology, such as figure 1 As shown, the assembly of the independent getter element 20 is to fix the electric heating wire 21 in it on the metal electrode 12 specially reserved on the shell 10 by means of spot welding, etc., and heat it to 300°C or higher and keep it It takes...

AI Technical Summary

Problems solved by technology

[0004] The problem with the traditional packaging process is that the installation process of the independent getter is different from other components in the shell, such as the process temperature, time and equipment used in the assembly of temperature control components, temperature measurement components, and MEMS devices. Due to the complexity of the device packaging process, it is very easy to reduce the production yield of MEMS devices due to the failure of the getter installation; in addition, the assembly method of the independent getter components has affected the reliability of the getter components. In the mechanical shock reliability test of the packaged device, the getter powder and particles often appear, which will directly lead to the scrapping of the device in severe cases; The metal heater is energized and heated to realize the activation and release of the getter, but the resistance of the metal heater is extremely small (tens to more than a hundred milliohms), so the release process is extremely vulnerable to the internal resistance of the line connecting the electrodes (tens of milliohms). ); Furthermore, the inconsistency of the assembly quality of the independent getter components will cause the inconsistency of the heat loss of the getter, which will lead to the instability of the temperature during the activation and release of the getter, and affect the getter after activation. Gas efficiency and service life of packaged devices

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