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Mounting table and plasma processing device

A technology of plasma and mounting table, applied in the direction of discharge tubes, electrical components, circuits, etc., can solve problems such as the reduction of insulation, and achieve the effect of suppressing the generation of particles or abnormal discharges

Active Publication Date: 2018-01-26
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in this example, since an opening, that is, a coupling portion is also formed, the technical problem of the present invention cannot be solved.
In addition, generally, a sprayed coating is formed on the surface of the base, and when a guide is provided on the surface of the flange, it is necessary to provide screw holes for fixing. Worried about reduced insulation

Method used

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  • Mounting table and plasma processing device
  • Mounting table and plasma processing device
  • Mounting table and plasma processing device

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0060] Hereinafter, for a configuration example of the first embodiment of the plasma processing apparatus including the mounting table of the present invention, refer to Figure 1 to Figure 11 Be explained. The plasma processing device is, for example, a device for performing prescribed plasma processing on a glass substrate G for manufacturing a liquid crystal display device (LCD), including: a vacuum container 2; a mounting table 3 placed in the center of the bottom surface of the vacuum container 2; The upper electrode 4 is provided above the mounting table 3 so as to face the mounting table 3 .

[0061] The vacuum container 2 is grounded, and an exhaust port 21 on the bottom surface of the vacuum container 2 is connected to a vacuum exhaust mechanism 23 via an exhaust path 22 . A pressure regulator (not shown) is connected to the vacuum exhaust mechanism 23 , whereby the inside of the vacuum container 2 is maintained at a desired vacuum degree. A substrate transfer port...

no. 2 approach

[0095] Next, refer to Figure 16 ~ Figure 20 A second embodiment of the present invention will be described. Figure 16 is a longitudinal sectional view of a plasma processing apparatus including a mounting table 8 according to a second embodiment, Figure 17 is along Figure 16 The cross-sectional view cut along the DD' line, Figure 18 is along Figure 17 A longitudinal section cut along line E-E' of Figure 19 is along Figure 17 Longitudinal sectional view cut along line F-F'.

[0096] The mounting table 8 of this embodiment includes a flange portion (stepped portion) on the outer edge portion of the mounting table main body. The stage main body is composed of a first electrode body 81 and a second electrode body 82 below it, and they are formed in, for example, a quadrangular column shape. The surface of the first electrode body 81 constitutes the substrate mounting surface 80 , and the planar shape of the second electrode body 82 is formed to be slightly larger th...

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PUM

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Abstract

Provided is a technology capable of suppressing the generation of particles or an abnormal discharge in a substrate stage around which a ring member formed of an insulating material is disposed. The substrate stage (3) provided in a plasma processing apparatus includes: a substrate stage body having a prism shape, and formed of a metal material; a recessed portion (61) forming a coupling portion formed on the lateral portion of the substrate stage body; and a positioning member (7) coupled to the recessed portion (61) to be mounted on the substrate stage body. Protruding portions (72, 73) are provided on an upper portion of the positioning member (7). A ring member (5) is mounted on the positioning member (7) such that recessed portions (55, 56) formed in the lower surface of the ring member (5) are interlocked with the protruding portions (72, 73). Thus, the upper surface of the ring member (5) is configured as a flat surface having no hole passing therethrough in a vertical direction, and a gap causing the generation of particles or a gap causing an abnormal discharge generated by fixing the ring member to the substrate stage with screws from the upper surface of the ring member is not formed, thereby suppressing the generation of the particles or abnormal discharge.

Description

technical field [0001] The present invention relates to a mounting table provided for mounting a substrate in a vacuum chamber for performing plasma processing, and a plasma processing apparatus provided with the mounting table. Background technique [0002] In the manufacturing process of FPD (Flat Panel Display), there is a process of performing predetermined plasma treatment such as etching treatment or film formation treatment on a glass substrate or the like. As a plasma processing apparatus for performing these steps, Patent Document 1 describes a configuration in which a susceptor as a lower electrode and a flat plate electrode as an upper electrode are provided in a chamber. In this configuration, by applying high-frequency power to the susceptor to generate plasma, the processing gas supplied from the flat plate electrode into the chamber is converted into plasma, and the substrate is subjected to plasma processing. [0003] The base of Patent Document 1 is formed ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J37/32
CPCH01J37/32715
Inventor 边见笃南雅人佐佐木芳彦
Owner TOKYO ELECTRON LTD