Red LED chip capable of avoiding electrode falling off and electrode treatment process therefor

Abstract

The invention provides a red LED chip capable of avoiding electrode falling off and an electrode treatment process therefor, belongs to the technical field of LED packaging, and aims to solve technical problems by providing the red LED chip capable of avoiding electrode falling off and the electrode treatment process therefor; due to the red LED chip and the treatment process, the degree of bonding between the electrode and a wafer is reinforced, and the product quality is effectively improved. The adopted technical scheme is as follows: the red LED chip capable of avoiding electrode falling off is disclosed, wherein the electrode is arranged in the middle of the chip; multiple through holes are formed in the electrode; coating film layers are adhered to the bottoms of the multiple through holes, and the surface of the electrode is also adhered to the coating film layer; three though holes are formed in the electrode; and the three through holes are triangularly distributed. Due to the structure and the treatment process, the degree of bonding between the electrode and the wafer is reinforced in die bonding, so that the condition of electrode falling off caused by overhigh power and pressure can be effectively prevented, and the product quality is effectively improved.

Description

technical field [0001] The invention discloses a red light chip capable of avoiding electrode loss and an electrode treatment process thereof, belonging to the technical field of LED packaging. Background technique [0002] SMD RGB full-color lamp bead packaging is composed of five processes: solid crystal, wire bonding, dispensing, light splitting, and tape. For the wire bonding process, the red chip is a single electrode, and the wire is bonded during the wire bonding process. Time, power, and pressure are relatively large, which can easily lead to electrode drop. Contents of the invention [0003] The present invention overcomes the deficiencies in the prior art, and the technical problem to be solved is to provide a red light chip that avoids electrode drop and its electrode treatment process, which enhances the adhesion between the electrode and the chip, and effectively improves product quality. [0004] In order to solve the above-mentioned technical problems, the ...

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Problems solved by technology

[0002] SMD RGB full-color lamp bead package is composed of five processes: solid crystal, wire bonding, dispensing, light splitting, and tape. For the wire bonding process, the red light chip is a single electrode, and the wire is bonded during the wire bonding process. The time, power, and pressure are relatively large, which can easily lead to electrode drop

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