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A thin film evaporation method and device

An evaporation and thin film technology, applied in vacuum evaporation coating, sputtering coating, ion implantation coating and other directions, can solve the problem of uneven thickness of organic thin film evaporation

Inactive Publication Date: 2018-01-23
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The embodiment of the present invention provides a thin film evaporation method and device to solve the problem of uneven thickness of organic thin film evaporation in the prior art

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  • A thin film evaporation method and device

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Embodiment Construction

[0035] The specific implementation of the thin film evaporation method and device provided by the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0036] Embodiments of the present invention provide a thin film evaporation method, such as figure 2 As shown, can include:

[0037] S101. Moving the line source parallel to the display substrate to be evaporated on the horizontal plane along a direction perpendicular to the line source, from the first end of the display substrate to the second end opposite to the first end of the display substrate at a constant speed;

[0038] S102, using a baffle to shield the line source;

[0039] S103. Rotate the line source or the display substrate 180 degrees clockwise or counterclockwise on the horizontal plane;

[0040] S104, open the baffle that blocks the line source;

[0041] S105. Return the line source from the second end of the display substrate to the first end...

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Abstract

The invention discloses a thin film evaporation method and device. The thin film evaporation method comprises: moving a line source parallel to a display substrate to be evaporated on a horizontal plane along a direction perpendicular to the line source at a constant speed from a first end of the display substrate to the second end opposite to the first end of the display substrate; use a baffle to block the line source; rotate the line source or the display substrate 180 degrees clockwise or counterclockwise on the horizontal plane; open the baffle that blocks the line source; The source returns from the second end of the display substrate to the first end of the display substrate at a constant speed along a direction perpendicular to the line source on the horizontal plane. In this way, after the first evaporation is completed, the line source or the display substrate is rotated, so that the positions of the line source and the display substrate are relatively rotated 180 degrees in the horizontal plane, and then the second evaporation is performed. Compared with the prior art, the relative position of the line source and the display substrate is maintained. Thin film evaporation can be completed in one continuous round trip without change, which can compensate for the difference in evaporation rate at both ends of the line source, and improve the uniformity of film thickness on the display substrate corresponding to the two ends of the line source.

Description

technical field [0001] The invention relates to the field of display technology, in particular to a thin film evaporation method and device. Background technique [0002] In the production process of organic electroluminescent display panels, the organic thin film layer is deposited by the method of evaporation of line evaporation source, generally as Figure 1a and Figure 1b As shown, when the organic thin film is evaporated, the line source S is arranged opposite to the display substrate G to be evaporated, and the line source goes back and forth continuously once to complete the thin film evaporation. However, due to the uneven heating of the line source, it is easy to cause differences in the evaporation rates at both ends of the line source (the two ends of the line source refer to the areas near the two top ends of the line source), resulting in a difference in the evaporation rate on the display substrate corresponding to the two ends of the line source. The uneven ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C14/24C23C14/54C23C14/12H01L51/56
CPCC23C14/12C23C14/24C23C14/542H10K71/00H10K2102/301
Inventor 罗昶吴海东马群
Owner BOE TECH GRP CO LTD