Method of making step groove on PCB

Abstract

The invention relates to the circuit board production technology field and especially relates to a method of making a step groove on a PCB. During inner layer line making, a copper layer to be removed on a step position is firstly kept; during a subsequent pre-formed groove gonging process, only a prepreg above the copper layer to be removed is gonged, the prepreg above the copper layer to be removed is burnt up with no burning copper laser and then a glue refuse is removed by using a plasma glue refuse removing method, and the copper layer to be removed is removed through alkaline etching so that a condition that a bottom of the step groove is damaged when a cover of a gong groove is taken off can be avoided and zero damage of the bottom of the step groove can be guaranteed. A problem that a window at a position of the prepreg corresponding to the step is opened in advance and water is stored so that pressing is layered and becomes white can be avoided and a yield rate is increased.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for making stepped grooves on a PCB. Background technique [0002] PCB (Printed Circuit Board), the Chinese name is printed circuit board, also known as printed circuit board. In order to meet certain functional requirements, it is necessary to make stepped grooves on the PCB. In the prior art, step grooves are made on the PCB, usually by first opening a window on the prepreg and padding the cover film and then pressing it, and then making the gong board in the subsequent process. The specific process is generally as follows: material cutting → inner layer circuit (etch away the copper layer at the step position at the same time) → inner layer AOI → browning → open a window on the prepreg corresponding to the step position → press fit (at the step position Pad cover film) → outer layer drilling → sinking copper → full board electroplating → outer layer...

AI Technical Summary

Problems solved by technology

[0003] The present invention aims at the problem that the existing method for making stepped grooves on PCBs is easy to accumulate water at the window opening of the stepped position, which may lead to the risk of damage to the bottom of the stepped groove during lamination or forming and uncovering, and provides a method that can avoid the step The method of making stepped grooves on the PCB caused by water accumulation at the window opening and preventing the bottom of the stepped grooves from being damaged