57results about How to "Avoid lamination" patented technology

Apparatus for cooking foods includes an external container, an internal container, open at the top, a heating device and a rotating mixing device. The mixing device is selectively removable and comprises at least one mixing blade driven by the rotation motion.

A heating apparatus for a semiconductor producing system is provided, including a heater having a mounting face, an opposed back face, a first resistance heating element, a second resistance heating element provided along substantially the same plane as the first heating element, a first terminal connected with the first heating element and a second terminal connected with the second heating element. A supporting member is fixed to the back face of the heater. First and second power supply means are respectively connected with the first and second terminals and contained in an inner space of the supporting member. A conductive connector connects the first heating element and the first terminal but not the second heating element. The first heating element is provided in a first zone, the second heating element is provided in a second zone, and the conductive connector is provided in the plane and the second zone.

A process for producing a cover (11) with a glass pane (14) for a motor vehicle roof, in which, first, a combination film (10) with a shatter prevention film and electrical function elements (22, 24, 26, 28, 30) integrated into the combination film is produced, and then, the combination film is securely attached to a side of the pane, e.g., the side facing the vehicle interior. Furthermore the invention relates to a cover for a motor vehicle roof produced in this manner.

A heat pump system for a vehicle includes a water cooled condenser that uses a coolant as a heat exchange media and uses waste heat generated from a motor and an electronic device to improve heating performance, efficiency, and dehumidifying performance. A control method is also described.

The invention relates to the circuit board production technology field and especially relates to a method of making a step groove on a PCB. During inner layer line making, a copper layer to be removed on a step position is firstly kept; during a subsequent pre-formed groove gonging process, only a prepreg above the copper layer to be removed is gonged, the prepreg above the copper layer to be removed is burnt up with no burning copper laser and then a glue refuse is removed by using a plasma glue refuse removing method, and the copper layer to be removed is removed through alkaline etching so that a condition that a bottom of the step groove is damaged when a cover of a gong groove is taken off can be avoided and zero damage of the bottom of the step groove can be guaranteed. A problem that a window at a position of the prepreg corresponding to the step is opened in advance and water is stored so that pressing is layered and becomes white can be avoided and a yield rate is increased.

The invention relates to an ink jet advertisement consumable material and a production method thereof. The ink jet advertisement consumable material sequentially comprises a transparent protection layer, an upper adhesive layer, an upper silicone oil layer, an upper base layer, a lower silicone oil layer, a lower adhesive layer, a lower base layer and an ink jet coating, wherein the upper base layer and the lower base layer are respectively made of plastic materials. According to the ink jet advertisement consumable material, materials for preparing conventional base layers are replaced, and the plastic materials with smooth and flat surfaces are adopted and used for forming the upper base layer and the lower base layer, so that the ink jet advertisement consumable material has the advantages of high definition and high permeability; meanwhile, conventional release paper is omitted, so that forest resources are saved; the ink jet advertisement consumable material is of an integrated structure, the material does not need to be laminated by film again during using; according to the production method, the processes of respectively processing synthetic PP coating paper and a coldly laminating film are omitted, so that the integrated production is achieved; the production efficiency is relatively high; in addition, due to the arrangement manner of the upper layer and the lower layer, the ink jet advertisement consumable material also has the advantage that products are relatively easy to peel off.

A stackable semiconductor assembly includes a semiconductor device, a heat spreader, an adhesive, a terminal, a plated through-hole and build-up circuitry. The heat spreader includes a bump, a base and a flange. The bump defines a cavity. The semiconductor device is mounted on the bump at the cavity, electrically connected to the build-up circuitry and thermally connected to the bump. The bump extends from the base into an opening in the adhesive, the base extends vertically from the bump opposite the cavity and the flange extends laterally from the bump at the cavity entrance. The build-up circuitry provides signal routing for the semiconductor device. The plated through-hole provides signal routing between the build-up circuitry and the terminal. The heat spreader provides heat dissipation for the semiconductor device.

The invention provides a substrate processing device comprising a processing chamber, a substrate perception component, a rotating shaft and a driving component. A part of the rotating shaft is arranged in the processing chamber, and at least one of the two end parts of the rotating shaft extends to the outside of the processing chamber. The substrate perception component is arranged on the rotating shaft and positioned outside the processing chamber. The driving component is fixed on the part, which is arranged in the processing chamber, of the rotating shaft. The driving component can drive the rotating shaft to rotate around the axis of the rotating shaft along a first direction when the driving component contacts a substrate to be processed. The driving component can drive the rotating shaft to rotate around the axis of the rotating shaft along a second direction opposite to the first direction when the substrate is away from the driving component. The invention also provides substrate processing equipment. The substrate perception component is arranged outside the processing chamber so that the substrate perception component is not influenced by processing fluid.

The invention relates to silver micro powder and a preparation method and application thereof, and relates to the technical field of functional materials. The preparation method comprises the following steps: preparing a silver nitrate solution at a temperature of 10-20 DEG C, a dispersant solution at a temperature of 30-60 DEG C, a morphology regulator solution at a temperature of 25-35 DEG C, a pH regulator solution at a temperature of 30-60 DEG C and a reducing agent solution at a temperature of 55-65 DEG C; adding the pH regulator solution into the silver nitrate solution, performing stirring, adding the morphology regulator solution, the reducing agent solution and the dispersing agent solution, performing mixing, adjusting the temperature to 30-60 DEG C, and performing reaction for 30-90 minutes; performing cleaning until the electric conductivity of the reacted product is less than 50 [mu]s/cm, and performing settling and separating; and adding a surface treating agent, performing drying, powdering and sieving to obtain a product. The mass of a morphology regulator is 0.1-0.5% of the mass of the silver micro powder, and the morphology regulator comprises at least one of silver chloride, silver bromide and silver iodide. The preparation method is simple and easy to implement and high in production efficiency.

The invention generally relates to the field of manufacture of semiconductor integrated circuits, particularly to a bearing device and a method adopting the device to transfer wafers. In the bearing device and the method adopting the device to transfer wafers, a movable sensor is arranged on a bearing platform, the position of the sensor can be set as per wafers of different specifications and sizes, so that the movable sensor can be used for recognizing and detecting wafers of different sizes and accurately detecting and recognizing wafers with special shapes, and overlapped wafers in a bearing platform can be effectively avoided, the danger of crushing wafers as wafers cannot be recognized is reduced, the yield of products is improved, the process cost is reduced, little modification is carried out to the conventional equipment, and the compatibility of the device is stronger.

A component unit for an electric machine includes an annular lamination stack formed of a plurality of axially stacked laminations. The lamination stack is secured by an inner or outer cylindrical fastening portion to a cylindrical receiving portion of a carrier element. The carrier element has two stops between which the lamination stack is axially clamped in a frictionally engaging manner. At least one of the axial stops has an annular supporting element arranged at the receiving portion and supports the lamination stack and which is fixed at the carrier element by at least one staking region.

The invention discloses a full-automatic mobile phone curved screen engraving and milling machine and an engraving and milling process thereof. The full-automatic mobile phone curved screen engravingand milling machine comprises a machine table, a lifting feeding mechanism, a conveying mechanism, a mechanical arm, a material platform, an engraving and milling head and a discharging box; the lifting feeding mechanism is arranged at one corner of the machine table and comprises a lifting assembly, a limiting assembly and a feeding assembly; the conveying mechanism is arranged on the side portion of the lifting feeding mechanism; the engraving and milling head is arranged at the rear side of the conveying mechanism; the material platform is arranged between the conveying mechanism and the engraving and milling head; a carrier is arranged on the material platform; the material platform comprises an upper-layer material platform and a lower-layer material platform, and the upper-layer material platform and the lower-layer material platform alternately receive materials from the conveying mechanism and then feed the materials to the position below the engraving and milling head; the discharging box is arranged at the front side of the conveying mechanism; and the mechanical arm is arranged among the material platform, the conveying mechanism and the discharging box in a striding manner. By means of the full-automatic mobile phone curved screen engraving and milling machine, automatic circulating feeding is achieved, the materials of different specifications are limited, air is blown while the materials are lifted to prevent material lamination, and chippings generated after engraving and milling of the materials can be removed.

A method for manufacturing an electronic assembly, including at least one electronic component and a circuit trace structure, by which the at least one electronic component is contacted. In the method, a conductive foil is patterned in a first step to form the circuit trace structure. In a second operation, the circuit trace structure is equipped with the at least one electronic component. In a final operation, another foil is laminated onto the conductive foil equipped with the at least one electronic component on the side on which the conductive foil is equipped with the at least one electronic component.