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Back alignment measurement system

A measurement system and silicon wafer alignment technology, applied in the field of integrated circuit equipment manufacturing, can solve the problems of small number of marks and strong position constraints, and achieve the effect of improving alignment accuracy and avoiding poor adaptability

Inactive Publication Date: 2016-07-27
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

However, it can only measure two fixed areas of the silicon wafer, and the disadvantages are: (1) The number of measured marks is small
(2) Strong position constraints on markers

Method used

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Embodiment Construction

[0029] Specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0030] figure 2 It is a schematic diagram of the structure of the back alignment device of the present invention. Such as figure 2 As shown, the device is composed of six parts including a workpiece table 2, a silicon wafer adsorption table 3, a rear alignment imaging lens 5, a CCD camera 6, a transmission infrared light source 1 and a controller. The workpiece table 2 fixes the silicon wafer adsorption table chuck3, and moves the window to the field of view of the imaging lens 5. The silicon wafer adsorption table chuck3 absorbs the silicon wafer 4 and drives the silicon wafer 4 to rotate. The light source 1 is a transmissive infrared light source for penetrating the silicon chip and forming an image on the lens object side. The image of the object plane is imaged on the CCD6 target surface by the infrared alignment imaging lens 5 . Th...

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Abstract

The present invention provides a wafer alignment measurement system. The system comprises the following parts: a workpiece stage, which is for supporting a wafer; a light source, which is used for irradiating an alignment mark on the wafer; and an image detection unit, which is used for acquiring transmission imaging information of the alignment mark. The system is characterized in that the workpiece table is provided with a light source channel, which is used for allow the light emitted from the light source to pass through light without block; the light source is on one side of the wafer and the workpiece stage, and the image detection unit is on the other side of the wafer and the workpiece table. The invention also provides a back alignment measurement method. The present invention employs transmissive infrared for aligning light source and passing through the wafers, directly images the wafer backside on lens object plane, and can effectively prevent poor adaptability of the reflection infrared alignment process. An employed rotary chuck table, unlike the alignment way of a back relay lens, has no limit on the number of the alignment marks and greatly improved alignment accuracy.

Description

technical field [0001] The invention relates to the technical field of integrated circuit equipment manufacturing, in particular to a backside alignment measuring device and method. Background technique [0002] The lithography machine is the most important, critical and complex equipment in the chip production process. Its main function is to expose the pattern on the mask to the silicon wafer. As today's chips are becoming more and more complex, multiple layers of exposure are often required on a chip, and the circuits between each layer must have a certain connection and coordination relationship. Therefore, the silicon wafer must be adjusted to a proper position before exposure, so that the current exposure can match the previously exposed pattern, which is alignment. [0003] In the preparation process such as MST and MEMS (micro-electromechanical system), both sides of the silicon wafer need to be exposed, and there is a certain relationship between the exposure patt...

Claims

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Application Information

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IPC IPC(8): G03F9/00
Inventor 周许超潘炼东杜荣
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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