Resin paste composition and semiconductor device
A technology of composition and resin paste, which is applied in the direction of conductor, semiconductor/solid-state device manufacturing, semiconductor/solid-state device parts, etc., to achieve the effect of less usage, excellent thermal conductivity and adhesion
Active Publication Date: 2018-07-03
RESONAC CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
Thus, a resin paste composition having properties equal to or higher than those of a conventional resin paste composition containing a large amount of silver powder has not yet been obtained for a resin paste composition in which the proportion of silver powder in the conductive filler is reduced.
Method used
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Examples
Experimental program
Comparison scheme
Effect test
Embodiment
[0141] Hereinafter, although an Example demonstrates this invention in detail, this invention is not limited to these Examples at all.
[0142] (Evaluation method)
[0143] The resin paste compositions of Examples and Comparative Examples were evaluated according to the following evaluation methods.
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Abstract
The present invention relates to a resin paste composition, which contains: (meth)acrylic acid compound (A), binder resin (B), amine compound (C), polymerization initiator (D), toughening agent (E) , silver powder (F) and aluminum powder (G), wherein, silver powder (F) contains the silver powder (F-1) that is coated with stearic acid and tap density is 4.0g / cm Below, the content of silver powder (F) is 42% by mass or less, the content of the silver powder (F-1) is 11% by mass or more, and the ratio of the content of the aluminum powder (G) to the content of the silver powder (F) is 0.3 to 2.3 in mass ratio. According to the present invention, an inexpensive resin paste composition suitable for bonding conductive elements such as semiconductor chips to support members such as lead frames and a semiconductor device using the resin paste composition can be obtained, It can reduce the amount of silver used, which is a rare and expensive material, and is also excellent in electrical conductivity, thermal conductivity, and adhesion.
Description
technical field [0001] The present invention relates to a resin paste composition suitable for die bonding of a semiconductor element, and a semiconductor device in which a semiconductor element and a supporting member are bonded using the resin paste. Background technique [0002] Au—Si eutectics, solder, resin paste compositions, and the like are known as die-bonding materials used in semiconductor devices. Among these, resin paste compositions are widely used from the viewpoint of workability and cost. [0003] Generally, a semiconductor device is manufactured by bonding a semiconductor element to a supporting member such as a lead frame using a die-bonding material. For die-bonding materials, on the one hand, high adhesive strength is required, and on the other hand, in order to reduce the warpage of the support member to which the semiconductor device is bonded, it is also required to absorb the difference between the thermal expansion rate of the element and the therm...
Claims
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IPC IPC(8): C08F2/44H01B1/00H01B5/00H01B5/16H01L21/52
CPCC08F2/44C08K2003/0806H01L23/295
Inventor 井上愉加吏山田和彦藤田贤
Owner RESONAC CORP