Graphite, metal foil, and foam buffer composite cooling fin

A composite heat sink and metal foil technology, which is applied in the direction of metal layered products, layered products, chemical instruments and methods, etc., can solve the problems of high local heating, color change, and heat dissipation of the light guide plate, etc., to achieve the best electromagnetic shielding Excellent function and cooling effect

Inactive Publication Date: 2016-08-03
QIHUA OPTRONICSKUNSHAN CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] After the internal structural parts of the mobile phone are thinned, the parts are closer together, but due to the improvement of the function and speed of the smart phone, the required power and power consumption are greater, so the heat generated by each part is greater, especially The liquid crystal display is the most serious. Because of the multi-information mobile phone, a larger liquid crystal display is required, and a finer picture requires a brighter display brightness. The backlight module of the liquid crystal display requires more light-emitting diodes, which also produces More heat, and the position of the light-emitting diode is between the liquid crystal display and the circuit board. The heat of the light-emitting diode is dissipated through the casing, and the liquid crystal display and the circuit board become a thermal barrier, so that the heat of the light guide plate cannot be dissipated. The local heat is too high, which not only affects the liquid crystal display, but also causes the hand feeling to be bad due to the high local heat.
[0005] After the structural parts in the mobile phone are thinned, the liquid crystal display will also be thinned, that is, the glass plate of the liquid crystal display will be thinned, and the glass plate of the liquid crystal display will be thinned. Pressurization deforms the glass, causing water ripples on the display screen or changing the color, which affects the use

Method used

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  • Graphite, metal foil, and foam buffer composite cooling fin
  • Graphite, metal foil, and foam buffer composite cooling fin
  • Graphite, metal foil, and foam buffer composite cooling fin

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Embodiment Construction

[0019] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0020] see figure 1 and figure 2 , the embodiment of the present invention includes: a graphite + metal foil + foam buffer composite heat sink, including: a graphite layer 1 and a metal foil layer 2, one side of the graphite layer 1 is attached with a layer of ring-shaped double-sided foam glue 3. The other side of the graphite layer 1 is pasted with a metal foil layer 2 through a double-sided adhesive 4, and a layer of ring-shaped double-sided foam adhesive 3 is also pasted on the surface of the metal foil layer 2.

[0021] Further, the finished thickness of the composite heat sink is 42 microns-1570 microns; the thickness of the double-sided ...

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Abstract

The invention discloses a graphite, metal foil, and foam buffer composite cooling fin, which comprises a graphite layer and a metal foil layer. A layer of circular double-faced foam glue is adhered on one surface of the graphite layer, the metal foil layer is adhered on the other side of the graphite layer through a double-faced adhesive tape, and a layer of circular double-faced foam glue is adhered on the surface of the metal foil layer. Through the technical scheme mentioned above, the cooling fin has a good thermal conductivity, can radiate heat rapidly, and is capable of effectively shielding the interference signals.

Description

technical field [0001] The invention relates to the technical field of heat dissipation of electronic heating components, in particular to a graphite+metal foil+foam buffer composite heat sink. Background technique [0002] At present, the CPU generates heat due to high-speed operation, and the demand for mobile phones, tablet computers, notebook computers and TVs developed to increase its operating speed and the use of display screens have increased. The demand for high-brightness display screens has increased the use of light-emitting diodes, which also increases The heat generated by large devices, while the battery power consumption increases, the battery capacity also increases, which makes the display device generate more heat due to the increased energy consumption. Shorten the service life of heating equipment. Moreover, heat dissipation materials must be introduced under high temperature conditions, and the internal space of mobile phones and tablet computers is li...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B9/00B32B9/04B32B15/04B32B15/20B32B7/12
CPCB32B9/007B32B7/12B32B9/041B32B15/04B32B15/20B32B2250/02B32B2307/212B32B2307/302
Inventor 刘宝兵
Owner QIHUA OPTRONICSKUNSHAN CO LTD
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