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Light emitting device, light emitting device package having same and light system having same

A technology of light-emitting devices and light-emitting structures, which is applied to semiconductor devices of light-emitting elements, semiconductor/solid-state device parts, lighting devices, etc., which can solve the problems of complicated manufacturing process, increased cost, and light absorption, and achieve improved light efficiency. , The effect of reducing the current concentration phenomenon and the intensity of the electric field

Active Publication Date: 2016-08-03
SUZHOU LEKIN SEMICON CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the cost of manufacturing the package may increase, the manufacturing process may be complicated, and light absorption may occur

Method used

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  • Light emitting device, light emitting device package having same and light system having same
  • Light emitting device, light emitting device package having same and light system having same
  • Light emitting device, light emitting device package having same and light system having same

Examples

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Embodiment Construction

[0018] In the description of the embodiments, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being on another substrate, another layer (or film), another region, another When a pad, or another pattern is "on" or "under", it can be "directly" or "indirectly" on another substrate, layer (or film), region, pad, or pattern, or also There may be one or more intermediate layers. Such positions of the layers have been described with reference to the drawings.

[0019] The thickness and size of each layer shown in the drawings may be exaggerated, omitted, or schematically drawn for description or clarification. Also, the size of elements does not truly reflect an actual size.

[0020] figure 1 is a cross-sectional view showing a light emitting device according to an embodiment.

[0021] refer to figure 1 , the light emitting device 100 according to the embodiment may include: a substrate 110; a light emitting structure 150 inclu...

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PUM

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Abstract

The invention relates to a light emitting device, a light emitting device package having the same and a light system having the same. The light emitting device may include a substrate, a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer provided on the substrate, a first electrode on the first conductive semiconductor layer, and a schottky guide ring configured to surround the first electrode and directly connect with the first conductive semiconductor layer.

Description

technical field [0001] Embodiments relate to a light emitting device, a light emitting device package including the light emitting device, and a lighting system. Background technique [0002] Light emitting diodes (LEDs) include P-N junction diodes having a characteristic of converting electrical energy into light energy, and may be formed using compound semiconductors of group III-V elements on the periodic table. In addition, LEDs can exhibit various colors achieved by adjusting the composition ratio of compound semiconductors. [0003] When a forward voltage is applied to the LED, as electrons of the N layer combine with holes of the P layer, energy is dissipated through the energy gap between the conduction band and the valence band. In the case of LEDs, energy is emitted in the form of light. [0004] Nitride semiconductors have attracted much attention in the fields of optical devices and high-power electronic devices due to their excellent thermal stability and wide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/60H01L33/14H01L33/40H01L33/64F21V19/00F21Y115/10
CPCF21V19/002H01L23/60H01L33/14H01L33/405H01L33/647H01L33/40H01L2924/181H01L2224/48091H01L33/387H01L2924/00014H01L2924/00012H01L33/0033H01L33/44H01L29/872H01L33/38H01L33/62H01L33/0008H01L33/30
Inventor 郑圣达李宗燮宋炫暾
Owner SUZHOU LEKIN SEMICON CO LTD