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Surface-treated copper foil, and products related thereto

A technology of surface treatment and surface treatment layer, applied in the direction of layered products, printed circuit manufacturing, metal layered products, etc., can solve problems such as poor conduction, poor copper plating, and poor quality of printed wiring boards

Active Publication Date: 2019-08-09
JX NIPPON MINING & METALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This smear leads to poor copper plating in vias, blind vias
This poor copper plating leads to poor conduction, which may lead to poor quality of printed wiring boards.

Method used

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  • Surface-treated copper foil, and products related thereto
  • Surface-treated copper foil, and products related thereto
  • Surface-treated copper foil, and products related thereto

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3、6、14

[0432] [Examples 1-3, 6, 14, Comparative Examples 1-3]

[0433] As a carrier, a 35-micrometer-thick long electrodeposited copper foil (JTC manufactured by JX Nippon Mining & Metals Co., Ltd.) was prepared. The glossy side (bright side) of this copper foil was electroplated on a roll-to-roll type continuous plating line under the following conditions, thereby forming 8000 μm / dm 2 The amount of Ni layer attached.

[0434] (Ni layer)

[0435] Nickel sulfate: 270~280g / L

[0436] Nickel chloride: 35~45g / L

[0437] Nickel acetate: 10~20g / L

[0438] Boric acid: 30~40g / L

[0439] Gloss agent: saccharin, butynediol, etc.

[0440] Sodium lauryl sulfate: 55~75ppm

[0441] pH value: 4~6

[0442] Bath temperature: 55~65℃

[0443] Current density: 10A / dm 2

[0444] After washing with water and pickling, electrolytic chromate treatment is carried out on the roll-to-roll continuous plating line under the following conditions to make 11μg / dm 2 The attached amount of the Cr layer is...

Embodiment 4

[0459] Copper sulfate electrolyte with a copper concentration of 80-120g / L, a sulfuric acid concentration of 80-120g / L, a chloride ion concentration of 30-100ppm, an animal glue concentration of 1-5ppm, and an electrolyte temperature of 57-62°C is used as an electrolytic copper plating bath, The linear flow velocity of the electrolyte flowing between the anode and the cathode (metal roll for copper foil plating) is 1.5 to 2.5 m / s, and the current density is 70 A / dm 2 Under certain conditions, the production thickness is 12μm (the weight thickness is 95g / m 2 ) double-sided flat electrolytic raw foil.

Embodiment 5

[0461] As the original foil, a rolled copper foil manufactured by JX Nippon Oil & Metal Co., Ltd. with a thickness of 12 μm was prepared.

[0462] A primary particle layer (Cu) and a secondary particle layer (copper-cobalt-nickel alloy plating layer, etc.) were formed on the surface of the original foils of the above-mentioned examples and comparative examples in the range of conditions shown below.

[0463] The bath composition and plating conditions used are shown in Tables 1-3. In the primary particle current condition column of Table 1, two kinds of current conditions and coulomb quantities are described as examples where plating was performed under the conditions described on the left and further plating was performed under the conditions described on the right. For example, "(65A / dm 2 、70As / dm 2 )+(20A / dm 2 、40As / dm 2 )", which means that the current density for forming primary particles is set to 65A / dm 2 , Coulomb volume is set to 70As / dm 2 After plating under ce...

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Abstract

The invention provides a copper oil with a processed surface, and related products. The copper foil can provide an outline shape after the substrate is removed. The outline shape can maintain a required concave-convex shape evenly if the copper foil is subjected to a decontamination treatment. The good adhering property of electrolysis-free copper film is realized. Moreover, the invention provides a substrate, even if the substrate is subjected to a decontamination treatment, the required concave-convex shape can be maintained, moreover, the good adhering property of electrolysis-free copper film is realized; the processed surface of the copper foil can be adhered on a resin substrate, then the copper foil is removed, the surface of the resin substrate is subjected to a swelling treatment, decontamination treatment, and a neutralization treatment, and the average value of white part of the processed surface of the resin substrate is 0.14 to 0.70 [mu]m.

Description

technical field [0001] The present invention relates to a method for producing a surface-treated copper foil, a copper foil with a carrier, a base material, a resin base material, a laminate, a printed wiring board, an electronic device, and a printed wiring board. Background technique [0002] Circuit formation processing methods for semiconductor package substrates and printed wiring boards are mainly subtractive processing methods. However, in recent years, with the high integration of semiconductors, the miniaturization of circuits used in semiconductor packaging substrates and printed wiring boards has progressed, and it has become increasingly difficult to form fine circuits by subtractive machining. [0003] As a countermeasure for further finer wiring, the following circuit forming processing method has attracted attention: Circuit forming processing method (1), using ultra-thin copper foil as a power supply layer, performing patterned copper plating, and finally rem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B15/20B32B15/08B32B27/16B32B7/06
CPCB32B7/06B32B15/08B32B15/20B32B27/16B32B15/01C25D1/04C25D7/0614H05K1/09H05K3/025H05K3/384
Inventor 森山晃正古曳伦也
Owner JX NIPPON MINING & METALS CORP