Method and system for judging temperature balance during measurement of micro-electromechanical products

Abstract

The invention relates to the technical field of product testing, and provides a method and system for judging temperature balance in the measurement process of micro-electromechanical products. The method includes: controlling to store the temperature data of each temperature sensor in the temperature data buffer; storing the newly collected temperature The data is compared with the temperature maximum value, temperature minimum value and preset temperature fluctuation range value in the corresponding temperature data buffer to determine whether each temperature data buffer meets the single temperature balance condition; when each temperature data of the test chamber When the temperature data in the buffer zone all meet a single temperature balance condition, it is judged whether the temperature of the test cavity is balanced; when the temperature maximum value and temperature minimum value in each temperature data buffer zone of the test cavity meet the temperature setting value and In the range of the temperature floating value, it is determined that the temperature of the test cavity is balanced, so as to quickly perform a balanced judgment on the temperature of the test cavity, and provide a good and stable test environment for the test chip.

Description

Technical field [0001] The invention belongs to the technical field of product testing, and in particular relates to a method and a system for determining temperature equilibrium in the measurement process of micro-electromechanical products. Background technique [0002] In the test and measurement of micro-electromechanical products, it needs to be carried out in a test cavity with a high temperature balance requirement. Only when the temperature of the test cavity reaches the balance requirement can chip testing, such as chip testing. [0003] Before the chip test, if the chip is tested when the temperature has not reached equilibrium or the temperature fluctuation exceeds the limit during the test of the chip and the temperature is not judged to be unbalanced, the collected chip data is failure data. When this happens, It is very possible to make a misjudgment on the tested chip, thus losing the significance of product testing and measurement. Summary of the invention [0004] ...

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Problems solved by technology

[0003] Before the chip test, if the chip is tested when the temperature is not balanced or the temperature fluctuation exceeds the limit during the test chip and the temperature imbalance is not judged, the collected chip data is failure data. When this happens, It is very likely to make a misjudgment of the chip under test, thus losing the meaning of product test measurement

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