Negative-type photosensitive resin composition, photocuring pattern formed by using the same and image display device

A technology of photosensitive resin and composition, applied in the field of photosensitive resin composition, can solve the problems of whitening and reduced developability, and achieve excellent adhesion, excellent low temperature curing, excellent heat resistance and chemical resistance. Effect

Active Publication Date: 2016-08-17
DONGWOO FINE CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] Korean Registered Patent No. 10-1249681 discloses a negative-type photosensitive resin composition comprising a copolymer polymerized using norbornene monomer, but since it contains a resin derived from benzylmaleimide, etc., it sometimes produces Problems such as decrease in developability and whitening phenomenon

Method used

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  • Negative-type photosensitive resin composition, photocuring pattern formed by using the same and image display device
  • Negative-type photosensitive resin composition, photocuring pattern formed by using the same and image display device
  • Negative-type photosensitive resin composition, photocuring pattern formed by using the same and image display device

Examples

Experimental program
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Effect test

manufacture example 1

[0149] Production example 1. Synthesis of alkali-soluble resin (first resin)

[0150] In a 1L flask equipped with a reflux cooler, a dropping funnel, and a stirrer, nitrogen was flowed in at 0.02L / min to form a nitrogen atmosphere, 300 parts by weight of methyl ethyl diglycol was charged, and heated to 70°C while stirring. ℃. Next, 20 parts by weight of norbornene, 30 parts by weight of styrene, 45 parts by weight of methacrylic acid, 3-acryloyloxy-2-hydroxypropyl methacrylate (3-Acryloyloxy-2- 135 parts by weight of hydroxypropyl methacrylate) were dissolved in 140 parts by weight of methyl ethyl diglycol to prepare a solution.

[0151] Using a dropping funnel, the produced solution was dropped into a flask kept at 70° C. over 4 hours. On the other hand, 30 parts by weight of the photopolymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in methyl ethyl diglycol 225 over a period of 4 hours using another dropping funnel. The solution in parts by we...

manufacture example 2

[0153] Production Example 2. Synthesis of Alkali-soluble Resin (Second Resin)

[0154]A 1 L flask equipped with a reflux cooler, a dropping funnel, and a stirrer was made into a nitrogen atmosphere, 300 parts by weight of methyl ethyl diglycol was charged, and it heated to 70 degreeC, stirring. Next, 300 parts by weight of a mixture of the following chemical formula 4 and chemical formula 5 (the molar ratio is 50:50), (3-ethyloxetan-3-yl) methyl methacrylate ((3-ethyloxetan - 150 parts by weight of 3-yl)methyl methacrylate) and 50 parts by weight of methacrylic acid were dissolved in 140 parts by weight of methyl ethyl diglycol to prepare a solution.

[0155] [chemical formula 4]

[0156]

[0157] [chemical formula 5]

[0158]

[0159] The produced solution was dropped into a flask kept at 70° C. using a dropping funnel over 4 hours. On the other hand, 30 parts by weight of the photopolymerization initiator 2,2'-azobis(2,4-dimethylvaleronitrile) was dissolved in met...

manufacture example 3

[0161] Production Example 3. Synthesis of Alkali-Soluble Resin (A-3)

[0162] Except that no norbornene (norbornene) was added, an alkali-soluble resin was produced in the same manner as in Production Example 1 above, and a copolymer having a solid content of 35.5% by weight and an acid value of 123.7 mg KOH / g (solid content conversion) was obtained ( A-3) solution.

[0163] At this time, the weight average molecular weight of the resin was 15,000, and the molecular weight distribution (Mw / Mn) was 2.3.

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Abstract

The present invention relates to a negative-type photosensitive resin composition cured at a low temperature, and having excellent adhesion with a substrate and chemical resistance, a photocuring pattern formed by using the same and an image display device comprising the pattern.

Description

technical field [0001] The present invention relates to a photosensitive resin composition. More specifically, it relates to a negative-type photosensitive resin composition capable of curing at low temperature and having excellent adhesion to a substrate and developability. Background technique [0002] In the display field, the photosensitive resin composition is used for forming various photocurable patterns such as photoresists, insulating films, protective films, black matrices, and columnar spacers. Specifically, the photosensitive resin composition is selectively exposed and developed through a photolithography process to form a desired photocuring pattern. In order to improve the yield in the process and improve the physical properties of the application object in this process, it is required to have a high Sensitive photosensitive resin composition. [0003] The patterning of the photosensitive resin composition utilizes a photolithography method, that is, a change...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F7/038
CPCG03F7/038G03F7/033G03F7/0382
Inventor 全志珉金圣彬梁敦植
Owner DONGWOO FINE CHEM CO LTD
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