Encapsulated conformal electronic systems and devices and methods of making and using the same
A device, conformal technology, applied in the field of encapsulating conformal electronic systems and devices and their fabrication and use, which can solve the problems of increased material and manufacturing costs, incompatibility of "thin chip" configurations, etc.
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example 1
[0075] In this example, a conformable electronic device including a humidity sensor (hereinafter "Ex 1 device") was encapsulated using an overmolding process. Ex 1 devices were encapsulated to have a final thickness of about 6 mm for the higher thickness measurement or about 2 mm for the water resistance measurement. Three plate molding tools (first plate 701, second plate 702, and third plate 703) are used for the overmolding process and in Figure 7A to Figure 7F is shown in . exist Figure 7A , Figure 7C and Figure 7E The board surface shown in is used to form the cap used to open the connector on a part of an Ex 1 device for higher thickness measurements, whereas in Figure 7B , Figure 7D and Figure 7F The panels shown in were used to form the envelope for water resistance measurements. A Model 44-226 25-Ton 5"-Stroke Self-leveling Laboratory Hydraulic Press, available from Dake Corporation, can be used for the foregoing molding process. Two different materials ...
example 2
[0080] An overmolding process was used to encapsulate the conformable electronic device (hereinafter "Ex 2 device"), including the device islands and interconnects. For at least some embodiments, Ex 2 devices are related to figure 2 and Figure 3A -B The described conformable electronic devices 200 and / or 300 are similar or substantially identical, and thus may include any of the corresponding options and features discussed with reference thereto. The Ex 2 devices are then encapsulated using essentially the same overmolding process as used to encapsulate the Ex 1 devices. In this example, the encapsulant used is Blue Star RTV4545. In other examples, alternative encapsulation materials may be used during the formation of Ex 2 devices. As shown, the encapsulated Ex 2 devices had an overall thickness of about 1 mm. Figure 9A and Figure 9B The top and bottom of a representative embodiment 900 of an encapsulated Ex 2 device are shown. Without destroying the functionalit...
example 3
[0082] In this example, a lamination process was used to encapsulate the humidity sensing conformable electronics (hereinafter "Ex 3 device"). In at least some embodiments, an Ex 3 device is similar or substantially identical to an Ex 1 device, and thus may include any of the corresponding options and features discussed with reference thereto. Ex 3 devices were encapsulated to have a thickness of about 1.0 mm to about 1.5 mm for waterproofing and reliability measurements.
[0083]In this example, use OS-20 TM Cleaning solution or other suitable cleaning material to clean the surface of the unencapsulated Ex 3 device and then allow it to dry. As a non-limiting example, use a lint-free towel to coat the surface of an Ex 3 device with Dow Corning OS TM Make a thin layer of primer and allow it to cure in ambient air for at least about 1 hr. The adhesive material used can be a two-part (parts A and B) liquid silicone such as SORTA-CLEAR (SMOOTH-ONTM), or any other equivale...
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Abstract
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