Plate type pulsating heat pipe and manufacturing method thereof

Abstract

A plate type pulsating heat pipe comprises two plate bodies which are fixed oppositely. Each plate body comprises a surface. A plurality of first grooves and second grooves are formed in the surfaces of the plate bodies in parallel, and the first grooves and the corresponding second grooves communicate. The first grooves and the second grooves of each plate body are arranged alternately. The width of each first groove is smaller than that of each second groove. The first grooves and the second grooves formed in one plate body are correspondingly matched with the first grooves and the second grooves formed in the other plate body, so that flow channels are formed between the two plate bodies. The flow channels are filled with working fluid. The invention further provides a manufacturing method of the plate type pulsating heat pipe.

Description

technical field [0001] The invention relates to the field of heat dissipation, in particular to a plate-type pulsating heat pipe and a manufacturing method thereof. Background technique [0002] Among the many cooling devices, the vapor chamber, also known as flat plate heat pipe, has been widely used in central processing units, graphics display processors, high-power Radiators for electronic devices such as transistors and high-power light-emitting diodes are used to ensure that these electronic devices can operate under normal conditions without failure due to overheating. [0003] Known vapor chambers include flow channels filled with a working fluid. One side of the vapor chamber (that is, the evaporation area) is pasted on a heating element (such as a central processing unit, a graphics chip, a north-south bridge chip, and a communication chip) to absorb the heat generated by the heating element, so that the liquid working fluid is evenly distributed. The evaporation...

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Problems solved by technology

However, the inner wall of the flow channel must also be provided with a capillary structure, so that the liquid working fluid can flow back to the evaporation area through capillary force to continue the gas-liquid circulation, so as to effectively achieve the effect of uniform temperature and heat dissipation, which undoubtedly greatly increases the manufacturing of the vapor chamber. cost

In addition, the capillary structure inside the vapor chamber is generally attached to the inner wall of the flow channel by such as sintering, and is not integrally formed on the inner wall of the flow channel, so the vapor chamber is easily deformed by external factors (such as collision, extrusion, etc. ), the capillary structure layer in the vapor chamber is easy to fall off, and the working fluid cannot flow, which will inevitably affect the overall heat transfer efficiency

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