Method and apparatus for detecting chip bonding conditions of printed circuit board
A printed circuit board and chip welding technology, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., can solve the problems of damaged power supply, burned out power supply, low efficiency, etc., and achieve the effect of improving the product qualification rate
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[0041] The core idea of the present invention is to provide a method and device for detecting the chip welding condition of the printed circuit board, which can quickly and non-destructively detect the chip welding condition of the printed circuit board, and locate the specific position of the short circuit after the chip welding, which is convenient for summary The reasons for insufficient soldering of printed circuit boards and the improvement of product qualification rate.
[0042] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the pr...
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