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Lightweight Paper Honeycomb Composite Panel with High Adhesive Hot Melt Adhesive Film

A hot-melt adhesive film, high-adhesive technology, applied in the direction of non-polymer adhesive additives, adhesive types, adhesives, etc., can solve the problems of increasing structural weight, etc., to achieve high peel strength and heat insulation performance High, good mechanical properties

Active Publication Date: 2019-07-16
CHANGCHUN FAW SIHUAN ASSEMBLY WELFARE PACKING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing sandwich structure is prone to damage such as degumming and delamination during the process of manufacture and use. Therefore, the so-called "core glue" is generally used for bonding the panel and the honeycomb core material to improve the peel strength. However, although the introduction of adhesives can improve the peel strength, it will increase the weight of the structure, especially for the sandwich structure with a low density honeycomb and thin skin, the increased weight is relatively large

Method used

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  • Lightweight Paper Honeycomb Composite Panel with High Adhesive Hot Melt Adhesive Film
  • Lightweight Paper Honeycomb Composite Panel with High Adhesive Hot Melt Adhesive Film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0029] The lightweight paper honeycomb composite board with high-adhesion hot-melt adhesive film in this embodiment, the composite board includes a lower skin 3, a lower hot-melt adhesive film 4, a honeycomb core stacked sequentially from bottom to top Material 2, the upper hot-melt adhesive film 5 and the upper skin 1 are composited, and the upper skin 1 and the lower skin 3 are glass cloth prepregs formed by impregnating glass cloth with a resin composition. Including by weight: 10 parts of diphenylmethane bismaleimide, 3 parts of o-diallyl bisphenol A, 5 parts of diallyl bisphenol A, 5 parts of polyether sulfone, 6 parts of polyether ketone ketone, 10 parts of imide, 1 part of emulsifier, 3 parts of acetone, 3 parts of ethylene glycol monomethyl ether; the raw materials of the lower hot-melt adhesive film 4 and the upper hot-melt adhesive film 5 include the following components by weight: 40 parts epoxy resin, 10 parts boric acid, 8 parts dimethyl polysiloxane, 10 parts low...

Embodiment 2

[0038]The lightweight paper honeycomb composite board with high-adhesion hot-melt adhesive film in this embodiment, the composite board includes a lower skin 3, a lower hot-melt adhesive film 4, a honeycomb core stacked sequentially from bottom to top Material 2, the upper hot-melt adhesive film 5 and the upper skin 1 are composited, and the upper skin 1 and the lower skin 3 are glass cloth prepregs formed by impregnating glass cloth with a resin composition. Including by weight: 20 parts of diphenylmethane bismaleimide, 8 parts of o-diallyl bisphenol A, 15 parts of diallyl bisphenol A, 10 parts of polyether sulfone, 12 parts of polyether ketone ketone, 20 parts of imide, 5 parts of emulsifier, 6 parts of acetone, 8 parts of ethylene glycol monomethyl ether (to improve stability); the raw materials of the lower hot-melt adhesive film 4 and the upper hot-melt adhesive film 5 include by weight The following components: 50 parts epoxy resin, 20 parts boric acid, 15 parts dimethyl...

Embodiment 3

[0047] The lightweight paper honeycomb composite board with high-adhesion hot-melt adhesive film in this embodiment, the composite board includes a lower skin 3, a lower hot-melt adhesive film 4, a honeycomb core stacked sequentially from bottom to top Material 2, the upper hot-melt adhesive film 5 and the upper skin 1 are composited, and the upper skin 1 and the lower skin 3 are glass cloth prepregs formed by impregnating glass cloth with a resin composition. Including by weight: 10 parts of diphenylmethane bismaleimide phenol, 8 parts of o-diallyl bisphenol A, 5 parts of diallyl bisphenol A, 10 parts of polyether sulfone, 6 parts of polyether ketone ketone, 20 parts of imide, 1 part of emulsifier, 6 parts of acetone, 3 parts of ethylene glycol monomethyl ether; the raw materials of the lower hot-melt adhesive film 4 and the upper hot-melt adhesive film 5 include the following components by weight: 40 parts epoxy resin, 20 parts boric acid, 8 parts dimethyl polysiloxane, 20 p...

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Abstract

The invention discloses a light weight paper honeycomb composite board with high-viscosity hot melt adhesive membranes. The composite board comprises the following layers, which are laminated from bottom to top in sequence: a lower envelope, a lower hot melt adhesive membrane, a honeycomb core material, an upper hot melt adhesive membrane, and an upper envelope. The upper envelope and the lower envelope are made of glass cloth prepreg, which is prepared by soaking a resin composition in glass cloth. The composite board has the advantages that the layers are tightly combined and thus are hard to peel off, the strong puncture-resistant performance and high buffering performance are integrated; during the manufacturing and using process, the phenomenon such as degumming, layering, and the like, is reduced; moreover, the composite board is light, and has good mechanical properties and strong soundproof and heatproof performances.

Description

technical field [0001] The invention relates to a paper honeycomb panel, in particular to a lightweight paper honeycomb composite panel with a high-adhesion hot-melt adhesive film. Background technique [0002] Honeycomb sandwich structure technology is a multidisciplinary interdisciplinary science, which runs through the preparation of raw materials, structural design to molding process and so on. However, due to its light weight, high strength, good flexural rigidity, smooth or flat surfaces, and good aerodynamic performance. The existing sandwich structure is prone to damage and damage such as degumming and delamination during the manufacturing and use process. Therefore, the so-called "board core glue" is generally used for bonding the panel and the honeycomb core material to improve the peel strength. However, although the introduction of the adhesive can improve the peel strength, it will increase the weight of the structure, especially for the sandwich structure with...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08L81/06C08L61/16C08K13/04C08K7/14C09J163/00C09J183/04C09J177/00C09J11/04C09J11/06B32B3/12B32B27/18B32B27/20B32B27/12B32B27/38B32B17/04B32B17/10
CPCB32B3/12B32B5/02B32B27/12B32B27/18B32B27/20B32B27/38B32B2260/021B32B2260/046B32B2262/101B32B2307/102B32B2307/304B32B2307/558C08L61/16C08L79/08C08L2205/03C08L2205/035C09J11/04C09J11/06C09J163/00C08L81/06C08K13/04C08K7/14C08L83/04C08L77/00C08K13/06C08K9/06C08K7/12C08K3/346C08K3/38
Inventor 尹渝杨仕春尹书勤
Owner CHANGCHUN FAW SIHUAN ASSEMBLY WELFARE PACKING
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