Resin-encapsulated semiconductor device and method of manufacturing the same

Abstract

Provided are a resin-encapsulated semiconductor device and a method of manufacturing the same. The resin-encapsulated semiconductor device is composed of a first resin-encapsulated body (25) and a second resin-encapsulated body (26), wherein the first resin-encapsulated body (25) comprises a first semiconductor element (2), an external terminal (5), an inner line (4) and first resin (6) covering all the elements; at least the back surface of the external terminal (5),the back surface of the semiconductor element (2), and the front surface of the inner line (4) are exposed from the first resin (6); the second resin-encapsulated body (26) comprises: a second semiconductor element (7) forming an electrode welding plate on the front side; second resin (8) covering the second semiconductor element (7); and a metal body connected to the electrode welding plate and exposed from the second resin, allowing the first resin-encapsulated body (25) and the second resin-encapsulated body (26) to be overlapped so as to electrically connect the inner line with the metal body.

Description

technical field [0001] The present invention relates to the structure of a multi-chip type resin-sealed semiconductor device and its manufacturing method. Background technique [0002] Along with the demand for downsizing, weight reduction and higher functionality of electronic equipment, semiconductor components mounted on electronic equipment are required to be mounted at high density, and in recent years, semiconductor devices that are smaller, thinner, and capable of high integration are required. [0003] Against the backdrop of this trend, various types of semiconductor devices have been proposed for various applications such as gull-wing type, leadless, BGA, and wafer-level packaging. Furthermore, in today's environment where the price of products is being lowered, these semiconductor devices are required to be able to be provided at a lower cost in addition to small and highly integrated functions. For example, in order to obtain higher integration functions such as...

AI Technical Summary

Problems solved by technology

Therefore, the unit price of each substrate is higher than that of a metal lead frame, making the overall packaging cost higher

[0007] Additionally, if Figure 7 of (2), Figure 7 As shown in (3), when performing multi-chip mounting or module mounting in which multiple semiconductor elements and electronic components are mounted in one semiconductor device, the method used is to mount multiple semiconductor elements adjacent to each other on the substrate, or to stack semiconductor elements. components, so as the number of mounted semiconductor elements or electronic parts increases, the size of semiconductor devices increases, making it difficult to make electronic equipment using semiconductor devices smaller, thinner, and more integrated

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