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Ni ball, ni core ball, solder joint, solder paste, and solder foam

A core ball, sphericity technology, applied in the field of solder paste and forming solder, Ni ball, Ni core ball, brazing joint, can solve the problem of solder ball crushing, unable to maintain the proper space of the substrate, etc., to improve the resistance to drop impact performance, suppressing unevenness in height, and ensuring the effect of automatic alignment

Active Publication Date: 2016-09-28
SENJU METAL IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, when BGA is applied to a semiconductor package mounted in three-dimensional high density, solder balls may be crushed due to the weight of the semiconductor package
If this happens, it becomes impossible to maintain proper space between the substrates

Method used

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  • Ni ball, ni core ball, solder joint, solder paste, and solder foam
  • Ni ball, ni core ball, solder joint, solder paste, and solder foam
  • Ni ball, ni core ball, solder joint, solder paste, and solder foam

Examples

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Effect test

Embodiment 1

[0082] Hereinafter, examples of the present invention will be described, but the present invention is not limited thereto. In this example, Ni balls with high sphericity were produced, and the Vickers hardness and α-ray dose of the produced Ni balls were measured.

[0083] ·Ni ball making

[0084] Study the production conditions of Ni balls with high sphericity. Prepare Ni wire with a purity of 99.9% (α-ray dose: 0.0034cph / cm 2 , U: 0.7ppb, Th: 0.5ppb), Ni wire with a purity of 99.995 or less (α-ray dose: 0.0026cph / cm 2 , U: <0.5ppb, Th: <0.5ppb). Each Ni wire was put into a crucible, and it preheated for 45 minutes under the temperature condition of 1000 degreeC. Then, the spraying temperature is set to 1600° C., preferably 1700° C., and liquid molten Ni is sprayed from a nozzle at a high speed by a gas atomization method, and the sprayed molten Ni is rapidly cooled to room temperature (18° C.), So as to make Ni balls. Thus, Ni balls having an average particle diameter ...

Embodiment 2

[0100] In Example 2, Ni balls produced from Ni wires having a purity of 99.995% or less shown in Table 1 were annealed and oxide film removed in the same manner as in Example 1. Then, the Vickers hardness of the obtained Ni balls was measured. In addition, the sphericity and α-ray dose of the Ni balls after the annealing treatment were measured by the above-mentioned methods, respectively. These measurement results are shown in Table 2 below.

Embodiment 3

[0114] Next, the sphericity and α-ray dose of the Ni core balls obtained using the above-mentioned Ni balls before and after the annealing treatment will be described. In Example 3, the sphericity and α-ray dose of the Ni core ball produced by coating the surface of the annealed Ni ball in Example 1 with a Ni plating layer of 1 μm on one side were measured by the above method. These measurement results are shown in Table 3 below.

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Abstract

Provided are: an Ni ball having strong falling-impact resistance and capable of suppressing the occurrence of joining failures and the like; an Ni core ball; a solder joint; a solder paste; and a solder foam. An electronic component (60) is configured in a manner such that a solder bump (30) of a semiconductor chip (10) and an electrode (41) of a printed circuit board (40) are joined by a solder paste (12, 42). The solder bump (30) is formed by joining a solder ball (20) to an electrode (11) of the semiconductor chip (10). This solder ball (20) exhibits a purity of 99.9-99.995%, inclusive, a sphericity of 0.90 or higher, and a Vickers hardness of 20-90HV, inclusive.

Description

technical field [0001] The present invention relates to Ni balls, Ni core balls, brazing joints, solder paste and shaped solder. Background technique [0002] In recent years, due to the development of small information equipment, the electronic components mounted therein are rapidly miniaturized. In response to the demand for miniaturization of electronic components, a ball grid array package (hereinafter referred to as "BGA") with electrodes provided on the rear surface is being used in order to cope with the reduction in the size of connection terminals and the reduction in mounting area. [0003] Among the electronic components using BGA, there is, for example, a semiconductor package. In the semiconductor package, a semiconductor chip having electrodes is sealed with resin. Solder bumps are formed on electrodes of the semiconductor chip. The solder bumps are formed by bonding solder balls to electrodes of the semiconductor chip. A semiconductor package using a BGA i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/00B22F1/02B23K35/14B23K35/22B23K35/30C22B23/06C22C19/03C22F1/00C22F1/10C25D7/00B22F1/065B22F1/107B22F1/16
CPCB23K35/22C22C19/03C22F1/00C22F1/10B23K35/3033B23K35/025B23K35/262B23K35/3612B23K35/3616B23K35/362C22C1/0425B22F1/065B22F1/107B22F1/16C25D7/00B22F2301/15B22F2302/45
Inventor 川崎浩由赤川隆小池田佑一池田笃史佐佐木优六本木贵弘相马大辅佐藤勇
Owner SENJU METAL IND CO LTD
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