Method and system for monitoring manufacturing machine

Abstract

The invention discloses a method and system for monitoring a manufacturing machine. Specifically, the method and system for monitoring a manufacturing machine are characterized in that according to the technological requirement, extracting part of wafers from a mother-batch of wafers as sub batches of wafers, and acquiring the pre-measurement data of the each sub batch of wafers corresponding to the pre-measurement data of each batch of wafers; after processing the sub batches of wafers on the manufacturing machine, utilizing the measuring device to acquire the post-measurement data of each sub batch of wafers; by means of the same processing and measurement, acquiring the post-measurement data of the mother-batch of wafers; and judging the data which is obtained through calculation of the measurement data related with the above basis, and optimizing or controlling the manufacturing machine or the product state, thus realizing complete data collection, effectively avoiding the problem that the sub batches cannot find the corresponding pre-measurement data so as to prevent faulty operation during the production process, being convenient for an engineer to use a subsequent analysis system to analyze and process problems, and being able to improve the product yield.

Description

technical field [0001] The invention relates to a data processing technology in the semiconductor manufacturing industry, in particular to a method and system for monitoring a manufacturing machine. Background technique [0002] In the manufacturing process of semiconductor integrated circuits, the performance of the manufacturing machine is monitored by measuring in units of lot in process (Lot). The performance of the manufacturing machine used in each process step of the semiconductor integrated circuit manufacturing process is one of the important reasons that directly affect the yield of semiconductor products. Therefore, it is very necessary to monitor and control the manufacturing machine every day. The monitoring of the manufacturing machine is mainly to obtain the monitoring data of the manufacturing machine by measuring the WIP. Therefore, when measuring the data of WIP, it is also measured, collected and analyzed in units of batches. The measurement of the param...

AI Technical Summary

Problems solved by technology

[0022] The existing processing method of manufacturing machine monitoring data needs to manually record the pre-measurement and post-measurement data and perform calculations. Manual calculations are prone to erroneous calculation results, leading to wrong judgments and affecting product yield. The ground affects the work efficiency and increases the production cycle of the wafer

In addition, during the pre-measurement, the sub-batch does not exist, so when the sub-batch is measured, the corresponding sub-batch pre-measurement data cannot be found according to the batch number, resulting in data loss, and the manufacturing machine cannot be fully reflected. The performance of the platform and the requirements to meet the specific process will ultimately affect the product yield

[0023] Due to the existence of the above problems, the actual effect of the entire semiconductor machine process parameter management system is much lower than expected, so a system and its corresponding method are needed to monitor the manufacturing machine

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