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Inserted needle interface-shaped heat sink for optical device

A technology of optical devices and heat sinks, applied in lighting and heating equipment, cooling/heating devices of lighting devices, lighting devices, etc., can solve the problems of inconsistent size of optical devices, increased production costs and use costs, etc., to achieve flexible use, Save production cost and use cost, easy to use

Inactive Publication Date: 2016-10-12
WUXI HI NANO TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, different types and types of optical devices have different sizes, and it is necessary to manufacture multiple types of matching heat sinks to install corresponding types of optical devices, which increases production costs and use costs

Method used

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  • Inserted needle interface-shaped heat sink for optical device

Examples

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Embodiment Construction

[0009] figure 1 is a schematic diagram of the present invention. like figure 1 As shown, the present invention includes a plurality of minimum unit heat sinks 1; each minimum unit heat sink 1 includes a substrate 2, and the substrate 2 is a rectangle; the front of the substrate 2 is the mounting surface 3, and the back of the substrate 2 is the heat dissipation surface 4; the heat dissipation surface 4 is provided with a plurality of neatly arranged vertical cooling plates 5; the periphery of the substrate 2 includes a male edge 7 and a female edge 8; the male edge 7 includes a plurality of neatly arranged plugs fixed on the side of the substrate The needle 9; the female edge 8 includes a plurality of neatly arranged holes 10 arranged on the side of the substrate 2;

[0010] For example, two minimum unit heat sinks can be plugged together to form a heat sink with twice the area. When inserting, the male edge of the first smallest heat sink unit is plugged with the female ed...

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Abstract

The invention discloses a pin-interface-shaped heat sink for an optical device, which includes a plurality of minimum unit heat sinks; each minimum unit heat sink includes a substrate, and the substrate is rectangular; the front of the substrate is an installation surface, and the back of the substrate is a heat dissipation surface ; The heat dissipation surface is provided with a plurality of neatly arranged vertical heat dissipation plates; the periphery of the substrate includes a male edge and a female edge; the male edge includes a plurality of neatly arranged plugs fixed on the side of the substrate pins; the female-shaped edge includes a plurality of neatly arranged holes arranged on the side of the substrate; the position and number of the pins are the same as the holes. Due to the large number of insertion pins in the present invention, the friction area is increased and the friction force is increased. Once the insertion is completed, it is not easy to loosen and can be moved at will. And after being fixed, it can be disassembled at will, which is more convenient to use.

Description

technical field [0001] The invention relates to the field of optical devices, in particular to a pin-shaped heat sink for optical devices. Background technique [0002] Active optical devices will generate a lot of heat while emitting light. If the heat is not dissipated in time, it will affect its luminous efficiency, affect the life of the optical device itself, and even directly cause damage to the optical device itself. In the prior art, the heat dissipation of the optical device is realized through a heat sink. However, different types and types of optical devices have different sizes, and it is necessary to manufacture multiple types of matching heat sinks to install corresponding types of optical devices, which increases production costs and use costs. Contents of the invention [0003] Aiming at the deficiencies of the prior art, the invention discloses a heat sink in the shape of a socket for an optical device. [0004] Technical scheme of the present invention ...

Claims

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Application Information

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IPC IPC(8): F21V29/503F21V29/76
CPCF21V29/503F21V29/76
Inventor 吕耀安
Owner WUXI HI NANO TECH