Chip testing method

A chip testing, chip technology, applied in the direction of single semiconductor device testing, measuring electricity, measuring devices, etc., can solve the problem of chip heating, etc., to achieve the effect of increasing temperature, simple method, and easy to use

Inactive Publication Date: 2016-10-12
JOULWATT TECH INC LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As for the mid-test, since the chip cannot be heated by the probe, there is currently no good way to perform temperature-related tests.

Method used

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Experimental program
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Embodiment Construction

[0028] The above and other technical features and advantages of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them.

[0029] Please refer to 1, the chip testing method provided by Embodiment 1 of the present invention is used to test the temperature-related test items of the chip in the mid-test or final test process of the chip, including the following steps:

[0030] S100. Apply voltage or current to the power device inside the chip to be tested, and control the temperature of the chip to be tested by adjusting the magnitude of the applied voltage or current and the corresponding application time, so that the temperature of the chip to be tested reaches a preset temperature temperature;

[0031] S200. After the temperature of the chip to be tested reaches a preset temperature, test the temperature-re...

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PUM

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Abstract

The invention provides a chip testing method, and the method is used for testing test items, related with temperature, of a chip in the intermediate and finished product testing technologies of the chip. The method comprises the steps: applying a voltage or a current to a power device in a to-be-tested chip, and controlling the temperature of the to-be-tested chip to reach preset temperature through adjusting the size of the applied voltage or current and the corresponding applying time; and testing the test items, related with the temperature, of the to-be-tested chip after the temperature of the to-be-tested chip reaches the preset temperature. The power device in the chip will consume power after power-on, thereby improving the overall temperature of the chip, and completing the testing of the test items, related with the temperature, of the chip without an additional heating device. The method is suitable for intermediate and finished product testing, is simple and is convenient to use.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a chip testing method. Background technique [0002] In general, the production test of the chip is divided into mid-test and final test. The mid-test refers to connecting the chip pins on the wafer to the test circuit through probes after the wafer tape-out is completed and before dicing and packaging. The chip is tested for function and parameters; the final test refers to the final test of the chip after the chip is packaged and connected to the test circuit by a robot. [0003] The functions and parameters of the chip will involve temperature-related test items, and the test workshop environment is constant temperature and humidity, so the chip needs to be heated to complete the temperature-related test items. For the test, the traditional method is to attach a heating device to the manipulator. When the manipulator grabs the chip, it will heat the chip, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/26
CPCG01R31/2601
Inventor 白浪黄必亮任远程周逊伟
Owner JOULWATT TECH INC LTD
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